ATS-19F-181-C2-R0
AI

The **ATS-19F-181-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure.
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### Technical Specifications
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions Inc. |
| **Series** | pushPIN™ |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Plastic or Brass) |
| **Thermal Resistance** | 11.95°C/W (Unducted Flow @ 100 LFM) |
| **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 10.00mm |
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### Key Components & Design Features
#### 1. Push-Pin Attachment
This part uses a specific **push-pin** mechanism combined with a compression spring.
* **Purpose:** Provides consistent pressure (clamping force) on the heat source to optimize thermal transfer.
* **Reliability:** It is more secure than thermal adhesive tape and easier to install/remove than screws in high-density PCB environments.
#### 2. Fin Profile (Straight Fin)
The "181" series typically utilizes a **Straight Fin** geometry.
* **Airflow:** Optimized for longitudinal airflow.
* **Efficiency:** The 10mm height is considered "low profile," making it ideal for compact enclosures or 1U server racks where vertical space is limited.
#### 3. Material and Coating
* **Aluminum Construction:** Offers a high strength-to-weight ratio and excellent thermal conductivity.
* **Blue Anodized Finish:** Not only provides a professional aesthetic but also adds a layer of corrosion resistance and slightly improves emissivity (heat radiation).
#### 4. Thermal Interface Material (TIM)
The "C2" suffix indicates that the heatsink comes pre-applied with **T766 thermal phase change material**.
* **Function:** Fills microscopic air gaps between the component surface and the heatsink base to maximize heat conduction.
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### Part Number Breakdown
```text
ATS - 19 - F - 181 - C2 - R0
| | | | | |
| | | | | +-- Revision Code
| | | | +------- Thermal Interface Material (T766)
| | | +------------ Series/Geometry Identifier
| | +----------------- Fin Attachment (F = Push-Pin)
| +--------------------- Dimension/Size Code
+--------------------------- Manufacturer (Advanced Thermal Solutions)
```
- ⤷
What is the maximum power dissipation (Watts) this heatsink can handle for a 20°C rise?
- ⤷ Are there different spring tensions available for the push-pin mechanism?
- ⤷ How does the 'unducted' thermal resistance compare to 'ducted' airflow scenarios?