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  • ATS-19F-181-C2-R0

  • AI
    The **ATS-19F-181-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Thermal Resistance** | 11.95°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 10.00mm | --- ### Key Components & Design Features #### 1. Push-Pin Attachment This part uses a specific **push-pin** mechanism combined with a compression spring. * **Purpose:** Provides consistent pressure (clamping force) on the heat source to optimize thermal transfer. * **Reliability:** It is more secure than thermal adhesive tape and easier to install/remove than screws in high-density PCB environments. #### 2. Fin Profile (Straight Fin) The "181" series typically utilizes a **Straight Fin** geometry. * **Airflow:** Optimized for longitudinal airflow. * **Efficiency:** The 10mm height is considered "low profile," making it ideal for compact enclosures or 1U server racks where vertical space is limited. #### 3. Material and Coating * **Aluminum Construction:** Offers a high strength-to-weight ratio and excellent thermal conductivity. * **Blue Anodized Finish:** Not only provides a professional aesthetic but also adds a layer of corrosion resistance and slightly improves emissivity (heat radiation). #### 4. Thermal Interface Material (TIM) The "C2" suffix indicates that the heatsink comes pre-applied with **T766 thermal phase change material**. * **Function:** Fills microscopic air gaps between the component surface and the heatsink base to maximize heat conduction. --- ### Part Number Breakdown ```text ATS - 19 - F - 181 - C2 - R0 | | | | | | | | | | | +-- Revision Code | | | | +------- Thermal Interface Material (T766) | | | +------------ Series/Geometry Identifier | | +----------------- Fin Attachment (F = Push-Pin) | +--------------------- Dimension/Size Code +--------------------------- Manufacturer (Advanced Thermal Solutions) ```
    ✨ Follow-up Questions
    • ⤷ What is the maximum power dissipation (Watts) this heatsink can handle for a 20°C rise?
    • ⤷ Are there different spring tensions available for the push-pin mechanism?
    • ⤷ How does the 'unducted' thermal resistance compare to 'ducted' airflow scenarios?