The **ATS-19F-178-C2-R0** is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "maxiFLOW™" series, specifically designed for cooling electronic components like processors, FPGAs, and ASICs. --- ## 1. Technical Specifications Below are the primary electronic and physical specifications for this component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-19F-178-C2-R0 | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 4.82°C/W (at 200 LFM) | | **Material** | Aluminum (Body) / Copper (optional base) | | **Finish** | Blue Anodized | | **Dimensions** | 45mm x 45mm x 15mm | | **RoHS Status** | Compliant | --- ## 2. Key Electronic Features ### A. pushPIN™ Attachment System Unlike adhesive-based heat sinks, this model uses a mechanical **pushPIN™** system. - **Benefit:** It provides a precise, consistent pressure (preload) on the electronic component, which improves thermal contact and prevents the heat sink from shifting during vibration or shipping. - **Components:** It features a brass component with a stainless steel spring. ### B. Thermal Performance (maxiFLOW™ Design) The "F" in the part number denotes a **fine-pitch fin** structure. - **Airflow Efficiency:** The graduated fin pattern increases the surface area while reducing pressure drop. - **Thermal Interface Material (TIM):** The "-C2" suffix typically indicates that the part comes pre-applied with **ATS-PPS-02** thermal grease, which ensures low thermal resistance between the silicon die and the heat sink. --- ## 3. Dimensions and Airflow Data The performance of this part is highly dependent on the velocity of air (measured in Linear Feet per Minute - LFM) provided by system fans. | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 | 7.10 | | 200 | 4.82 | | 300 | 3.67 | | 400 | 3.00 | --- ## 4. Part Number Breakdown Understanding the nomenclature helps in identifying variants: - **ATS**: Advanced Thermal Solutions. - **19**: Series/Form factor. - **F**: Fin style (Fine). - **178**: Specific geometry code. - **C2**: Thermal Interface Material type (T766 or similar high-performance grease). - **R0**: Revision/Packaging code.