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  • ATS-19F-153-C2-R0

  • AI
    The **ATS-19F-153-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed specifically for cooling electronic components like CPUs, GPUs, and other integrated circuits. --- ## 🛠️ Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-19F-153-C2-R0 | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push Pin (with Spring) | | **Thermal Resistance** | 1.19 °C/W @ 200 LFM | | **Dimensions (L x W x H)** | 40mm x 40mm x 30mm | | **Fin Style** | Straight Fin | --- ## 🧩 Key Component Breakdown ### 1. The Heat Sink Body The body is made of **Aluminum 6063**, which provides a balance between thermal conductivity and weight. The **Blue Anodized** finish is not just for aesthetics; it increases the surface emissivity, allowing for better heat radiation and protecting the aluminum from corrosion. ### 2. Attachment Mechanism (Push Pins) This part utilizes a **plastic push-pin and brass spring** assembly. * **Reliability:** Provides a consistent "mating pressure" against the chip, ensuring optimal heat transfer. * **Safety:** The spring prevents over-tightening which could crack the silicon die of the component. ### 3. Thermal Interface Material (TIM) The "R0" suffix usually indicates that the heat sink comes with a **pre-applied Thermal Interface Material** (typically Chomerics T766). This fills the microscopic air gaps between the component and the heat sink. --- ## 📈 Performance Characteristics The efficiency of this part depends heavily on the airflow (LFM - Linear Feet per Minute) within the electronic enclosure: | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **200** | 1.19 | | **400** | 0.85 | | **600** | 0.62 | --- ## 💡 Application Use Cases * **Embedded Systems:** Cooling industrial processors. * **Telecommunications:** Cooling ASICs in switches and routers. * **Power Electronics:** Used on MOSFET modules or high-power voltage regulators.
    ✨ Follow-up Questions
    • ⤷ What is the hole pattern requirement for the push-pin installation?
    • ⤷ How does the blue anodized finish affect thermal performance compared to bare aluminum?
    • ⤷ Can this heat sink be used with a custom thermal pad instead of the pre-applied TIM?