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  • ATS-19F-15-C2-R0

  • AI
    The **ATS-19F-15-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The model name follows a specific nomenclature that defines its physical and thermal characteristics: | Property | Specification | Details | | :--- | :--- | :--- | | **Component Type** | Heat Sink | Passive cooling component | | **Series** | pushPIN™ | Uses a push-pin attachment mechanism | | **Material** | Aluminum | Lightweight with high thermal conductivity | | **Finish** | Blue Anodized | Increases surface emissivity and prevents corrosion | | **Dimensions** | 45mm x 45mm | Standard square footprint | | **Height** | 10mm | Low profile design | | **Thermal Resistance** | 26.30 °C/W (Unducted) | Performance at 0.5 m/s airflow | | **Attachment Type** | Push-Pin | Spring-loaded plastic pins for PCB mounting | --- ### 2. Key Design Features ### A. pushPIN™ Mounting System The part utilizes the **pushPIN™** attachment system, which consists of a flexible spring and a plastic pin. This provides: * **Constant Pressure:** Ensures the heat sink remains in firm contact with the component. * **Ease of Assembly:** Can be installed manually or with basic tools. * **Reliability:** Resistant to vibration and mechanical shock. ### B. Fin Geometry The "F" in the part number often indicates a **Fine Pitch** or specific fin orientation. The straight fin design is optimized for: * **Laminar Airflow:** Best used in systems with dedicated fans or forced air cooling. * **Surface Area:** Maximizes the contact area between the metal and the surrounding air. ### C. Thermal Interface Material (TIM) Usually, these parts come with a pre-applied **Phase Change Material (PCM)** or high-performance thermal pad on the base to minimize air gaps between the chip and the heat sink. --- ### 3. Applications This specific part is typically found in: 1. **Networking Hardware:** Routers, switches, and hubs. 2. **Industrial PCs:** Compact systems requiring low-profile cooling. 3. **Power Electronics:** DC-DC converters and voltage regulators. ---
    ✨ Follow-up Questions
    • ⤷ What is the exact thermal resistance of this part at higher airflow speeds (e.g.
    • ⤷ 2.0 m/s)?
    • ⤷ Does the ATS-19F-15-C2-R0 come with a pre-applied thermal interface material?
    • ⤷ What is the weight of this heat sink in grams?