The **ATS-19F-142-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed to provide efficient cooling for electronic components like processors, FPGAs, and ASICs. --- ### ## Technical Specifications Below are the core technical details for this specific part number: | Parameter | Specification | | :--- | :--- | | **Product Series** | pushPIN™ | | **Thermal Resistance (Flowing)** | 7.22 °C/W (@100 LFM) to 2.25 °C/W (@700 LFM) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Brass) | | **Spring Type** | Compression Spring (Stainless Steel) | | **Interface Material** | T766 (Phase Change Material) | | **Dimensions** | 25mm x 25mm x 15mm | --- ### ## Component Analysis ### 1. Thermal Performance The "C2" in the part number indicates a specific thermal performance profile. This heat sink uses a **Fine Pitch design**, which increases the surface area for heat dissipation. It is highly effective in forced-air environments (systems with fans). ### 2. Attachment Mechanism (Push Pin) Unlike adhesive-based heat sinks, the **ATS-19F-142-C2-R0** uses a mechanical push-pin system. * **Reliability:** Provides constant pressure (preload) for better thermal contact. * **Installation:** Requires pre-drilled holes in the PCB (typically 3.0mm holes). * **Springs:** Uses a stainless steel spring to ensure the heat sink stays flush against the chip even during mechanical shock or vibration. ### 3. Material and Coating * **Aluminum 6063:** Chosen for its excellent thermal conductivity and lightweight properties. * **Blue Anodized Finish:** This is not just for aesthetics; the anodization process provides increased corrosion resistance and slight improvements in surface emissivity. ### 4. Thermal Interface Material (TIM) The unit comes pre-applied with **T766**. This is a high-performance phase-change material that melts when the component gets hot, filling microscopic air gaps between the chip and the heat sink for maximum heat transfer. --- ### ## Applications * **Embedded Systems:** Industrial PCs and controllers. * **Telecommunications:** Network switches and routers. * **Power Electronics:** Voltage regulators and high-speed memory modules.