The **ATS-19F-06-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power semiconductors. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Family** | pushPIN™ Heat Sink Assembly | | **Attachment Type** | Push-Pin | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W)** | 45.00 mm x 45.00 mm | | **Height (H)** | 10.00 mm | | **Thermal Resistance** | 16.32 °C/W (at 100 LFM) | | **Thermal Interface Material (TIM)** | T766 (High Performance) | --- ### 2. Key Design Features * **Push-Pin Attachment:** This model uses a plastic or brass push-pin mechanism with a spring-loaded system. This ensures a consistent and secure pressure against the electronic component for optimal heat transfer. * **Fin Geometry:** It features a **Fine Pitch** design, which increases the surface area for cooling. This is particularly effective in environments with forced-air cooling (fans). * **T766 Thermal Interface Material:** The base comes pre-applied with a high-performance thermal pad (T766), which fills microscopic air gaps between the component surface and the heat sink. * **Blue Anodized Coating:** This finish is not just for aesthetics; it provides corrosion resistance and increases surface emissivity. --- ### 3. Application Use Cases This specific heat sink is typically used in the following electronic systems: 1. **Embedded Systems:** For cooling SOCs (System on Chips) in industrial computers. 2. **Networking Equipment:** Used on high-speed switches and routers where board space is tight but thermal demands are high. 3. **Power Electronics:** Cooling MOSFETs or Voltage Regulators in power supply units. --- ### 4. Thermal Performance Comparison The effectiveness of this part varies based on the airflow (LFM - Linear Feet per Minute): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 16.32 | | 300 (1.5 m/s) | 6.10 | | 500 (2.5 m/s) | 4.08 | | 700 (3.5 m/s) | 3.20 | ---