ATS-19E-101-C2-R0
AI

The **ATS-19E-101-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from surface-mount components like CPUs, GPUs, or power transistors.
### 1. Technical Specifications
The following table summarizes the key physical and thermal properties of this specific model:
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | pushPIN™ |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Dimensions (L x W x H)** | 45mm x 45mm x 30mm |
| **Attachment Method** | pushPIN™ (Spring-loaded pins) |
| **Thermal Resistance** | 6.69° C/W @ 100 LFM |
| **Fin Style** | Straight Fin |
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### 2. Key Electronic & Mechanical Features
#### A. Attachment Mechanism (pushPIN™)
The "R0" designation refers to the attachment system. It uses a **push-pin and brass spring** assembly.
* **Security:** Provides firm, even pressure across the electronic component for optimal heat transfer.
* **Ease of Use:** Allows for quick installation without the need for specialized tools or messy adhesives.
#### B. Thermal Interface Material (TIM)
The part number suffix **C2** indicates the pre-applied thermal material:
* **Type:** T766 Phase Change Material.
* **Function:** It fills microscopic air gaps between the component surface and the heat sink base, significantly lowering thermal resistance.
#### C. Fin Design
The **Straight Fin** geometry is optimized for "active" cooling environments where there is a constant airflow (CFM) from a system fan. The 30mm height provides a large surface area for heat dissipation without occupying excessive vertical space in a server or desktop chassis.
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### 3. Application Use Cases
This component is typically used in the following electronic systems:
* **Telecommunications:** Cooling of high-speed networking chips.
* **Embedded Systems:** Dissipating heat from industrial PCs and controllers.
* **Power Electronics:** Managing heat for Voltage Regulator Modules (VRMs).
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What are the alternative attachment methods to pushPIN for this size heat sink?
- ⤷ How does 'Blue Anodized' finish affect thermal performance compared to bare aluminum?
- ⤷ Can this heat sink be used in a passive cooling environment without a fan?