công cụ tìm kiếm bảng dữ liệu linh kiện điện tử
  Vietnamese  ▼
ALLDATASHEET.VN

X  

  • ATS-19E-101-C2-R0

  • AI
    The **ATS-19E-101-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from surface-mount components like CPUs, GPUs, or power transistors. ### 1. Technical Specifications The following table summarizes the key physical and thermal properties of this specific model: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 45mm x 45mm x 30mm | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Thermal Resistance** | 6.69° C/W @ 100 LFM | | **Fin Style** | Straight Fin | --- ### 2. Key Electronic & Mechanical Features #### A. Attachment Mechanism (pushPIN™) The "R0" designation refers to the attachment system. It uses a **push-pin and brass spring** assembly. * **Security:** Provides firm, even pressure across the electronic component for optimal heat transfer. * **Ease of Use:** Allows for quick installation without the need for specialized tools or messy adhesives. #### B. Thermal Interface Material (TIM) The part number suffix **C2** indicates the pre-applied thermal material: * **Type:** T766 Phase Change Material. * **Function:** It fills microscopic air gaps between the component surface and the heat sink base, significantly lowering thermal resistance. #### C. Fin Design The **Straight Fin** geometry is optimized for "active" cooling environments where there is a constant airflow (CFM) from a system fan. The 30mm height provides a large surface area for heat dissipation without occupying excessive vertical space in a server or desktop chassis. --- ### 3. Application Use Cases This component is typically used in the following electronic systems: * **Telecommunications:** Cooling of high-speed networking chips. * **Embedded Systems:** Dissipating heat from industrial PCs and controllers. * **Power Electronics:** Managing heat for Voltage Regulator Modules (VRMs).
    ✨ Follow-up Questions
    • ⤷ What are the alternative attachment methods to pushPIN for this size heat sink?
    • ⤷ How does 'Blue Anodized' finish affect thermal performance compared to bare aluminum?
    • ⤷ Can this heat sink be used in a passive cooling environment without a fan?