The **ATS-19D-101-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Property | Specification | | :--- | :--- | | **Product Type** | Heat Sink | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W x H)** | 45mm x 45mm x 30mm | | **Fin Type** | Straight Fin | | **Thermal Resistance** | 1.02°C/W (at 200 LFM) | --- ### 2. Key Component Breakdown #### A. The pushPIN™ Attachment System Unlike adhesive-based heat sinks, this model uses a **pushPIN™** mechanism. * **Springs:** Provides a precise, calculated pressure (preload) to optimize thermal interface material (TIM) performance. * **Plastic/Brass Pins:** Secure the heat sink through pre-drilled holes in the Printed Circuit Board (PCB). #### B. Thermal Performance (LFM - Linear Feet per Minute) Thermal resistance varies based on the airflow provided by system fans: * **Unducted Flow:** 2.03°C/W @ 100 LFM. * **High Velocity:** Drops to approximately 0.84°C/W @ 700 LFM. #### C. Material and Coating * **AL6063 Aluminum:** Chosen for its high thermal conductivity and lightweight properties. * **Blue Anodizing:** This is not just aesthetic; the anodized layer increases surface emissivity, slightly improving radiation heat transfer and providing corrosion resistance. --- ### 3. Application Use Cases This specific heat sink is categorized under the **"fine-pitch"** or **"high-performance"** series, typically used in: 1. **Telecommunications:** High-speed routers and switches. 2. **Embedded Systems:** Industrial PCs where vertical space is limited to 30mm. 3. **Power Electronics:** Cooling MOSFET arrays or voltage regulators. --- ### 4. Mounting Hole Diagram Reference To use this part, the PCB must be designed with the following hole spacing: `40.00mm x 40.00mm` (Center to Center).