The **ATS-19B-91-C2-R0** is a specific electronic component categorized as a **High-Performance Heat Sink**, manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push pin" attachment series, designed primarily for cooling BGA (Ball Grid Array) components and CPUs on Printed Circuit Boards (PCBs). --- ### Technical Specifications Below are the primary technical characteristics of the ATS-19B-91-C2-R0: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Heat Sink Type** | Straight Fin | | **Attachment Method** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 6.19 °C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 40mm x 40mm x 10mm | --- ### Key Components & Design Features #### 1. Heat Sink Geometry (Straight Fin) The part utilizes a straight fin design. This is optimized for **forced air cooling** environments (where a fan is present). The orientation of the fins allows air to pass through the channels, stripping heat away from the aluminum surface. #### 2. Material and Coating * **Aluminum 6063:** Chosen for its high thermal conductivity and lightweight properties. * **Blue Anodizing:** This is not just for aesthetics; the anodized layer provides a thin protective coating that prevents corrosion and slightly increases the surface emissivity for better radiant heat transfer. #### 3. Attachment Mechanism (Push-Pins & Springs) The "R0" at the end of the part number typically refers to the specific attachment kit included: * **Push-Pins:** These are inserted through pre-drilled holes in the PCB. * **Compression Springs:** These ensure that a constant, uniform pressure is applied to the interface between the heat sink and the chip, which is critical for minimizing thermal contact resistance. --- ### Performance Data The thermal resistance of this unit varies based on the airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **100** | 6.19 | | **200** | 3.62 | | **300** | 2.89 | | **400** | 2.49 | --- ### Common Applications * **Networking Hardware:** Switches, routers, and high-speed modems. * **Embedded Systems:** Industrial PCs and automation controllers. * **Power Supplies:** Cooling voltage regulators or power transistors. * **ASICs & FPGAs:** Providing thermal relief to high-density logic chips.