The **ATS-19B-65-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed to provide efficient cooling for integrated circuits (ICs) and other electronic surface-mount devices. --- ### 1. Technical Specifications The following table breaks down the core physical and thermal characteristics of the part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Al) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **Dimensions (L x W)** | 45.00mm x 45.00mm | | **Height** | 20.00mm | | **Thermal Resistance** | 7.29 °C/W (at 200 LFM) | | **Fin Style** | Straight Fin | --- ### 2. Key Electronic Components & Materials The "electronics" of this part are primarily passive, focusing on thermal dissipation rather than signal processing. * **Heat Sink Body:** Constructed from extruded aluminum. Aluminum is chosen for its high thermal conductivity and lightweight properties, allowing it to draw heat away from a processor's die effectively. * **Thermal Interface Material (TIM):** This specific model typically comes with **T766** pre-applied. The TIM is a phase-change material that fills microscopic air gaps between the chip and the heat sink to maximize heat transfer. * **Mechanical Fasteners:** It utilizes brass push-pins and steel springs. This system provides consistent pressure (clip force) against the electronic component, which is critical for maintaining thermal contact under vibration or thermal expansion. --- ### 3. Application Use Cases The ATS-19B-65-C2-R0 is commonly used to cool the following types of electronic hardware: 1. **BGA (Ball Grid Array) Packages:** High-density processors found on motherboards. 2. **FPGA/ASIC:** Custom logic chips that generate significant heat during high-speed calculations. 3. **Telecommunications Gear:** High-speed routers and switches where airflow is managed but space is limited. --- ### 4. Part Number Breakdown | Segment | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions (Manufacturer) | | **19B** | Series Designator (Push-Pin series) | | **65** | Height/Fin Configuration Code | | **C2** | Thermal Performance/Material Grade | | **R0** | RoHS Compliance Status |