The **ATS-19B-41-C2-R0** is a specific electronic cooling component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **maxiFLOW™** series of high-performance heat sinks designed for telecommunications, networking, and high-heat density electronic devices. --- ### 1. Technical Specifications The part is characterized by its unique "flared fin" design which maximizes surface area for air-flow. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Series** | maxiFLOW™ | | **Material** | Aluminum (with Blue Anodized finish) | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W x H)** | 45mm x 45mm x 17.5mm | | **Thermal Resistance** | 10.02°C/W (Unducted @ 100 LFM) | | **TIM (Interface Material)** | T766 (High performance phase change) | --- ### 2. Breakdown of the Part Number Understanding the nomenclature helps identify the exact physical properties of the component: * **ATS**: Manufacturer prefix. * **19B**: Series identifier (maxiFLOW with pushPIN attachment). * **41**: Specific size/geometry code (45mm footprint). * **C2**: Color/Finish (Blue Anodized). * **R0**: Revision code. --- ### 3. Key Electronic/Mechanical Features #### A. Flared Fin Design Unlike standard straight-fin heat sinks, the fins on the ATS-19B-41-C2-R0 are angled outward. This reduces pressure drop and allows for better air ingestion from multiple directions, which is critical in densely packed PCBs where airflow may be turbulent. #### B. pushPIN™ Attachment System This part uses a mechanical attachment system consisting of: * **Brass/Plastic Pins**: To secure the heat sink to the PCB. * **Compression Springs**: These provide precise, uniform pressure (Force) across the chip surface, ensuring optimal thermal contact without cracking the silicon die. #### C. Thermal Interface Material (TIM) The "C2-R0" variants usually come pre-applied with **T766**. This is a thermal pad/paste that fills the microscopic air gaps between the electronic component (CPU/FPGA) and the aluminum base of the heat sink. --- ### 4. Typical Applications This component is typically mounted on high-power integrated circuits such as: 1. **FPGAs/ASICs** in network routers. 2. **Processors** in embedded industrial computers. 3. **Power modules** that require compact, high-efficiency cooling.