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  • ATS-19B-06-C2-R0

  • AI
    The **ATS-19B-06-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push-pin" series designed for securing cooling solutions directly to Printed Circuit Boards (PCBs). ### Technical Specifications The following table summarizes the physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum (Al) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 25.00mm | | **Fin Style** | Straight Fin | | **Thermal Resistance** | ~2.00°C/W (at 200 LFM) | --- ### Key Electronic & Mechanical Features #### 1. Thermal Management The primary electronic function of this part is to dissipate heat from integrated circuits (ICs), such as CPUs, GPUs, or FPGAs. By increasing the surface area, it prevents thermal throttling and hardware failure due to overheating. #### 2. Push-Pin Mounting System * **Mechanism:** Uses a pre-drilled hole system on the PCB. * **Pressure:** The compression springs provide precise, consistent pressure across the thermal interface material (TIM), ensuring optimal heat transfer. * **Material:** The "C2" in the part number typically refers to the specific combination of the aluminum material and the blue anodized finish, which provides corrosion resistance and electrical insulation. #### 3. Straight Fin Design The straight fin geometry is optimized for **forced air cooling** (fans). It allows air to flow through the channels with minimal resistance, making it suitable for high-density electronic enclosures. ### Application Use Cases * **Computing:** Cooling chipsets on motherboards. * **Telecommunications:** Managing heat in routers and high-speed switches. * **Industrial Power:** Cooling power transistors and voltage regulators. ---
    ✨ Follow-up Questions
    • ⤷What is the recommended thermal interface material for this heat sink?
    • ⤷ How do I calculate the thermal resistance for different airflow speeds?
    • ⤷ What are the PCB hole diameter requirements for the push-pin mounting?