The **ATS-18F-99-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **pushPIN™** series, designed for efficient heat dissipation in compact electronic systems. --- ### 1. Technical Specifications The part number encodes specific physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Dimensions (L x W x H)** | 45mm x 45mm x 20mm | | **Pitch** | Fine Pitch (Cross-Cut) | | **Thermal Resistance** | 11.55 °C/W (Unducted Flow @ 100 LFM) | --- ### 2. Design Components #### A. Fin Pattern (Cross-Cut) The "Fine Pitch" cross-cut design maximizes surface area while allowing airflow from multiple directions. This is critical for high-density PCB layouts where airflow may be turbulent or non-linear. #### B. Attachment: pushPIN™ System Unlike adhesive tapes or clips, this part uses a spring-loaded push-pin mechanism. - **Benefits:** Provides consistent pressure (interface load) to optimize thermal interface material (TIM) performance. - **Components:** Usually paired with a compression spring and a plastic/brass pin that snaps into pre-drilled holes on the PCB. #### C. Thermal Interface Material (TIM) The "C2" suffix typically indicates that the heatsink comes pre-applied with **T766 phase-change material** or a high-performance thermal grease to ensure a low thermal resistance path between the component (CPU/GPU/ASIC) and the aluminum base. --- ### 3. Thermal Performance Profile The effectiveness of this heatsink depends on the air velocity (LFM - Linear Feet per Minute) within the enclosure: | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 11.55 | | 300 (1.5 m/s) | 3.32 | | 500 (2.5 m/s) | 2.10 | | 700 (3.5 m/s) | 1.66 | --- ### 4. Typical Applications This specific size and height (20mm) make it suitable for: - **Networking/Telecommunications:** Routers, switches, and base stations. - **Industrial Computers:** Cooling high-speed processors or FPGAs. - **Power Supplies:** Dissipating heat from MOSFETs or power modules.