The **ATS-18F-97-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### ## Technical Specifications Below are the core technical parameters for the ATS-18F-97-C2-R0: | Property | Description / Value | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Type** | Top Mount Heat Sink | | **Material** | Aluminum (Blue Anodized Finish) | | **Attachment Method** | Push-pin (Brass) | | **Dimensions** | 45mm x 45mm x 10mm | | **Thermal Resistance** | 20.30 °C/W (Unducted @ 100 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### ### Key Features 1. **Low Profile Design:** With a height of only 10mm, it is ideal for space-constrained electronic enclosures or slim server blades. 2. **Fine Pitch Fin Geometry:** The fins are designed to maximize surface area, allowing for efficient heat transfer even in low-airflow environments. 3. **Push-Pin Attachment:** * Uses a flexible, spring-loaded push-pin mechanism. * Provides high pressure for consistent contact with the heat source. * Reduces the risk of mechanical damage to the PCB. 4. **Pre-applied TIM:** It comes with **T766 thermal interface material**, which ensures low thermal resistance between the component and the heat sink right out of the box. --- ### ### Typical Applications * **Integrated Circuits (ICs):** Cooling FPGAs, ASICs, and specialized processors. * **Networking Gear:** Used in switches, routers, and high-speed modems. * **Embedded Systems:** Industrial PCs and automation controllers where vertical space is limited.