The **ATS-18F-96-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like BGA (Ball Grid Array) chips, CPUs, or GPUs. --- ### Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Part Number** | ATS-18F-96-C2-R0 | | **Product Category** | Heat Sinks | | **Fin Type** | Push-Pin (High Performance) | | **Attachment Method** | Push-Pin (with Compression Springs) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | Variable based on Airflow (LFM) | --- ### Key Design Features #### 1. Push-Pin Attachment Mechanism This part utilizes a **Push-Pin** system with a compression spring. * **Purpose:** Provides consistent pressure on the heat source to optimize thermal transfer. * **Assembly:** Requires pre-drilled holes in the PCB (Printed Circuit Board). * **Material:** The pins are usually made of brass or plastic, providing a secure and vibration-resistant mount. #### 2. Fin Geometry (Straight Fin) The "96" series typically features a straight-fin design. * **Airflow:** Designed for forced-air cooling environments. * **Efficiency:** The high fin density increases surface area, allowing more heat to be transferred to the surrounding air. #### 3. Material and Coating * **Aluminum 6063:** Lightweight with excellent thermal conductivity. * **Blue Anodizing:** This isn't just for aesthetics; the anodized layer provides corrosion resistance and increases thermal emissivity. --- ### Dimensions and Footprint While specific CAD dimensions should be verified via the datasheet, the **96 series** generally follows standard BGA sizing: * **Base Dimensions:** Typically 45mm x 45mm (or similar standard square sizes). * **Height:** The "18F" designation often refers to a specific fin height or profile within the ATS catalog. --- ### Applications This part is commonly used in: * **Telecommunications:** High-speed routers and switches. * **Embedded Systems:** Industrial PCs and controllers. * **Consumer Electronics:** High-performance gaming consoles or workstations. --- ### Comparison: Active vs. Passive Cooling | Feature | ATS-18F-96-C2-R0 | Active Cooler (Fan) | | :--- | :--- | :--- | | **Moving Parts** | None (Passive) | Fan included (Active) | | **Reliability** | Extremely High (No MTBF) | Moderate (Fan can fail) | | **Power Consumption** | 0 Watts | Requires 1-5 Watts | | **Noise** | Silent | Audible |