The **ATS-18F-95-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications Below are the primary technical parameters for this specific model: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Thermal Resistance** | 7.29°C/W (at 100 LFM) | | **Dimensions (L x W)** | 40mm x 40mm | | **Height** | 25mm | | **Fin Style** | Fine Pitch (High Density) | --- ### 2. Key Design Features * **pushPIN™ Attachment:** This model features a specialized attachment system that allows for quick and secure mounting to a PCB (Printed Circuit Board). It uses a spring-loaded mechanism to ensure consistent pressure between the heat sink and the component. * **Thermal Interface Material (TIM):** The "C2" in the part number indicates it typically comes with **T766** thermal phase change material pre-applied to the base, ensuring optimal heat transfer right out of the box. * **Fin Configuration:** The "F" in the part number indicates a **Fine-Pitch** fin design. This increases the surface area for cooling, making it highly effective in systems with forced air cooling (fans). * **Material:** Made from lightweight aluminum with a blue anodized finish, which provides better emissivity and corrosion resistance. --- ### 3. Part Number Breakdown The nomenclature of the ATS-18F-95-C2-R0 can be decoded as follows: 1. **ATS-18:** Series identifier. 2. **F:** Fine-pitch fin pattern. 3. **95:** Specific geometry/sizing code. 4. **C2:** Thermal Interface Material type (T766). 5. **R0:** Revision code / RoHS compliant. --- ### 4. Typical Applications This heat sink is commonly found in: * **Telecommunications:** Cooling of high-speed networking chips. * **Embedded Systems:** Industrial PCs and controllers. * **Power Electronics:** Cooling of MOSFETs or voltage regulators. * **Computing:** Secondary cooling for chipsets or localized heat sources.