The **ATS-18F-93-C2-R0** is a high-performance electronic component classified as a **Heat Sink**, specifically designed for cooling integrated circuits (ICs) and other electronic packages. It is part of the Advanced Thermal Solutions (ATS) *pushPIN™* series. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Fin Type** | Straight Fin | | **Dimensions** | 40mm x 40mm x 20mm | | **Thermal Resistance (Unducted)** | 1.87 °C/W @ 100 LFM | | **Thermal Resistance (Ducted)** | 1.06 °C/W @ 100 LFM | | **Pressure Flow** | Cross-cut for omnidirectional airflow | --- ### 2. Component Composition The part number breakdown reveals specific design choices for thermal management: * **Heat Sink Body:** Constructed from high-conductivity aluminum to rapidly pull heat away from the component. * **Thermal Interface Material (TIM):** Pre-applied with **T766** phase-change material to ensure low thermal resistance between the chip and the sink. * **Attachment Mechanism:** Uses a compression spring and push-pin system. This ensures consistent pressure, which is critical for long-term reliability and efficient heat transfer. --- ### 3. Key Applications This specific model is typically used in environments where space is moderate but heat dissipation requirements are high, such as: 1. **Network Switches/Routers:** Cooling high-speed processors. 2. **Power Supplies:** Managing heat for voltage regulators. 3. **Industrial Controls:** Protecting PLCs and motor controllers from overheating. --- ### 4. Airflow Performance Table The efficiency of the ATS-18F-93-C2-R0 depends heavily on the Airflow (measured in Linear Feet per Minute - LFM): | Velocity (LFM) | 100 | 200 | 300 | 400 | 500 | | :--- | :--- | :--- | :--- | :--- | :--- | | **Thermal Res (°C/W)** | 1.87 | 1.25 | 1.00 | 0.86 | 0.77 |