## Technical Overview of ATS-18F-72-C2-R0 The **ATS-18F-72-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions, Inc. (ATS)**. It is part of the **push-pin** attachment series, designed for cooling electronic components such as CPUs, GPUs, and other integrated circuits that require efficient thermal management in restricted spaces. --- ### 1. General Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-18F-72-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (with springs) | | **Thermal Resistance** | ~5.11°C/W (at 100 LFM) | --- ### 2. Physical Dimensions The physical footprint of the heat sink determines its compatibility with the PCB layout and nearby components. * **Length:** 45.00 mm * **Width:** 45.00 mm * **Height:** 25.00 mm * **Pitch (Hole spacing):** Approx. 38.00 mm --- ### 3. Key Components and Features #### A. Fin Design (Straight Fin) The "F" in the part number denotes a **Straight Fin** geometry. This design is optimized for environments with high-velocity airflow. The gaps between the fins allow air to pass through linearly, stripping heat away from the aluminum surface. #### B. Material and Coating * **Aluminum 6063:** Provides a high strength-to-weight ratio and excellent thermal conductivity. * **Blue Anodized Finish:** This is not just for aesthetics; anodizing increases the surface emissivity, slightly improving radiant heat transfer and providing corrosion resistance. #### C. Push-Pin Attachment System The "C2" suffix typically refers to the attachment hardware. * **Push-Pins:** Plastic or brass pins that snap into pre-drilled holes on the PCB. * **Compression Springs:** These provide consistent downward pressure on the electronic component, ensuring a tight interface between the chip and the heat sink. #### D. Thermal Interface Material (TIM) The "R0" indicates the presence of a pre-applied **Thermal Interface Material**. Usually, this is a high-performance phase-change material or thermal pad that eliminates the need for manual application of thermal grease, ensuring uniform coverage and low thermal resistance. --- ### 4. Performance Data (Airflow) | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 | 5.11 | | 200 | 2.36 | | 300 | 1.68 | | 400 | 1.39 | --- ### 5. Application Use Cases * **Telecommunications:** Cooling of high-speed processors in switches and routers. * **Embedded Systems:** For industrial PCs where space is limited but thermal loads are high. * **Power Electronics:** Dissipating heat from MOSFETs or Power Management ICs (PMICs).