ATS-18F-70-C2-R0
AI

The **ATS-18F-70-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or failure.
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## 1. Technical Specifications
The part number encodes specific physical and material characteristics:
| Parameter | Specification | Detail |
| :--- | :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions | P/N: ATS-18F-70-C2-R0 |
| **Heat Sink Type** | pushPIN™ | Uses a spring-loaded attachment mechanism |
| **Material** | Aluminum | Lightweight with high thermal conductivity |
| **Finish** | Blue Anodized | Increases surface emissivity and corrosion resistance |
| **Dimensions** | 45mm x 45mm x 25mm | Width x Length x Height |
| **Attachment Type** | Push-Pin | Secure mechanical fastening |
| **Thermal Interface Material** | T766 | High-performance pre-applied phase change material |
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## 2. Component Design Features
### Physical Geometry
* **Fin Type:** Straight Fin. This design is optimized for environments where there is a consistent, unidirectional airflow.
* **Pitch:** The spacing between the fins is engineered to balance surface area with pressure drop (the resistance the sink offers to moving air).
### Attachment Mechanism (pushPIN™)
The "R0" at the end of the part number typically refers to the specific attachment kit included. The **pushPIN™** system consists of:
1. **Compression Springs:** Ensure even pressure across the component surface for maximum heat transfer.
2. **Flexible Pins:** Designed to fit into pre-drilled holes (typically 3.0mm) on the PCB.
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## 3. Thermal Performance Data
Performance depends on the Air Velocity (Measured in Linear Feet per Minute - LFM):
| Airflow Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 (0.5 m/s) | ~3.64 |
| 200 (1.0 m/s) | ~2.14 |
| 400 (2.0 m/s) | ~1.46 |
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## 4. Part Number Breakdown
Understanding the nomenclature helps in selecting alternatives:
* **ATS-18**: The series/family of the heat sink.
* **F**: Fin style (Straight Fin).
* **70**: Specific dimensions/footprint code.
* **C2**: Material/Finish code (Blue Anodized).
* **R0**: Packaging/Kit version.
- ⤷
What is the hole-to-hole spacing required on the PCB for this heat sink?
- ⤷ Can this heat sink be used in passive cooling (natural convection) environments?
- ⤷ How does the T766 thermal interface material compare to standard thermal grease?