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  • ATS-18F-70-C2-R0

  • AI
    The **ATS-18F-70-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or failure. --- ## 1. Technical Specifications The part number encodes specific physical and material characteristics: | Parameter | Specification | Detail | | :--- | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions | P/N: ATS-18F-70-C2-R0 | | **Heat Sink Type** | pushPIN™ | Uses a spring-loaded attachment mechanism | | **Material** | Aluminum | Lightweight with high thermal conductivity | | **Finish** | Blue Anodized | Increases surface emissivity and corrosion resistance | | **Dimensions** | 45mm x 45mm x 25mm | Width x Length x Height | | **Attachment Type** | Push-Pin | Secure mechanical fastening | | **Thermal Interface Material** | T766 | High-performance pre-applied phase change material | --- ## 2. Component Design Features ### Physical Geometry * **Fin Type:** Straight Fin. This design is optimized for environments where there is a consistent, unidirectional airflow. * **Pitch:** The spacing between the fins is engineered to balance surface area with pressure drop (the resistance the sink offers to moving air). ### Attachment Mechanism (pushPIN™) The "R0" at the end of the part number typically refers to the specific attachment kit included. The **pushPIN™** system consists of: 1. **Compression Springs:** Ensure even pressure across the component surface for maximum heat transfer. 2. **Flexible Pins:** Designed to fit into pre-drilled holes (typically 3.0mm) on the PCB. --- ## 3. Thermal Performance Data Performance depends on the Air Velocity (Measured in Linear Feet per Minute - LFM): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | ~3.64 | | 200 (1.0 m/s) | ~2.14 | | 400 (2.0 m/s) | ~1.46 | --- ## 4. Part Number Breakdown Understanding the nomenclature helps in selecting alternatives: * **ATS-18**: The series/family of the heat sink. * **F**: Fin style (Straight Fin). * **70**: Specific dimensions/footprint code. * **C2**: Material/Finish code (Blue Anodized). * **R0**: Packaging/Kit version.
    ✨ Follow-up Questions
    • ⤷ What is the hole-to-hole spacing required on the PCB for this heat sink?
    • ⤷ Can this heat sink be used in passive cooling (natural convection) environments?
    • ⤷ How does the T766 thermal interface material compare to standard thermal grease?