The **ATS-18F-41-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The part number itself contains encoded information about the size, material, and thermal performance. | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Material** | Aluminum (AL6063) | | **Dimensions (L x W x H)** | 40mm x 40mm x 20mm | | **Fin Type** | XC Cut (Cross-cut) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | | **Color/Finish** | Blue Anodized | --- ### 2. Physical Design Features * **XC Cut (Cross-Cut) Pattern:** This design uses a grid-like fin structure. Unlike straight fins, cross-cut fins allow for multi-directional airflow, making it highly effective in systems where the exact direction of air from cooling fans might vary. * **Push-Pin Mounting:** The "R0" designation refers to the mounting kit. This system uses a spring-loaded push-pin mechanism that provides the necessary pressure for optimal heat transfer while allowing for easy installation and removal without tools. * **T766 Thermal Interface Material:** This is a phase-change or high-performance thermal pad pre-applied to the base. It fills microscopic air gaps between the heat sink and the electronic component to maximize thermal conductivity. --- ### 3. Thermal Performance Indicators Thermal resistance is measured based on the airflow (velocity) within the chassis: | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | ~10.02 | | 400 (2.0 m/s) | ~3.10 | | 700 (3.5 m/s) | ~2.10 | *Note: Lower °C/W values indicate better cooling efficiency.* --- ### 4. Typical Applications * **Integrated Circuits (ICs):** Cooling FPGAs, ASICs, and processors. * **Power Electronics:** Dissipating heat from VRMs or MOSFETs. * **Networking Hardware:** Used in switches and routers where airflow is controlled by internal fans.