ATS-18F-40-C2-R0
AI

The **ATS-18F-40-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the *Blue Ice* series and is designed for efficient cooling of semiconductors and integrated circuits (ICs).
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### 1. Technical Specifications
The following table outlines the physical and thermal characteristics of the part:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Plastic) |
| **Spring Type** | Compression Spring |
| **Thermal Resistance** | 1.21 °C/W (at 200 LFM) |
| **Dimensions (L x W x H)** | 40mm x 40mm x 25mm |
| **Fin Style** | Straight Fin |
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### 2. Breakdown of the Part Number
The part number follows a specific nomenclature used by ATS to identify the component's features:
- **ATS-18**: Refers to the specific series/model family.
- **F**: Denotes the Fin pitch or density.
- **40**: Represents the base dimensions (40mm square).
- **C2**: Indicates the thermal interface material (TIM) or specific coating (Blue Anodized).
- **R0**: Refers to the revision code or packaging status (usually RoHS compliant).
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### 3. Key Component Features
#### A. Push-Pin Mounting
This part utilizes a push-pin attachment mechanism.
- **Mechanism:** Plastic pins with integrated springs are pushed through pre-drilled holes in the PCB.
- **Benefit:** It provides a secure, consistent downward force on the component, ensuring optimal contact with the heat source while allowing for easy installation.
#### B. Material and Coating
- **Aluminum (6063):** Chosen for its high thermal conductivity and lightweight properties.
- **Blue Anodizing:** This is not just for aesthetics; the anodized layer provides electrical insulation and improves corrosion resistance.
#### C. High Performance Fins
The straight-fin design is optimized for **forced air cooling** (environments with fans). The spacing between fins is calculated to minimize pressure drop while maximizing the surface area available for heat dissipation.
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### 4. Applications
The ATS-18F-40-C2-R0 is commonly used in:
1. **Network Switches/Routers:** Cooling ASICs and high-speed processors.
2. **Power Supplies:** Dissipating heat from MOSFETs and voltage regulators.
3. **Embedded Systems:** Protecting industrial PCs from thermal throttling.
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What are the alternative mounting methods if my PCB doesn't have holes?
- ⤷ How does 'LFM' (Linear Feet per Minute) affect the thermal resistance of this heatsink?
- ⤷ Is this heatsink compatible with pre-applied thermal interface materials?