## Technical Overview: ATS-18F-38-C2-R0 The **ATS-18F-38-C2-R0** is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** series, designed specifically for cooling electronic components such as processors, FPGAs, and ASICs. --- ### 1. Key Technical Specifications | Parameter | Value / Detail | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Thermal Resistance (Flowing)** | 0.82 °C/W @ 200 LFM | | **Thermal Resistance (Static)** | 4.84 °C/W (Unducted) | | **Dimensions (L x W x H)** | 36.83mm x 36.83mm x 22.86mm | --- ### 2. Component Design Features The part is engineered for high-density electronic environments where airflow direction can be critical. * **maxiFLOW™ Fin Design:** The tapered fin structure maximizes surface area to dissipate heat efficiently while maintaining a low pressure drop. * **pushPIN™ Mounting:** This refers to the hardware used to secure the heat sink to the PCB. It typically includes a brass or plastic pin and a stainless steel spring to provide consistent pressure on the component (TIM interface). * **Thermal Interface Material (TIM):** The "R0" suffix usually indicates that the part comes pre-applied with a high-performance thermal pad or grease, ready for immediate installation. --- ### 3. Thermal Performance Comparison Performance varies based on the velocity of the air (measured in Linear Feet per Minute - LFM) passing through the fins: | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 | 1.15 | | 200 | 0.82 | | 300 | 0.69 | | 400 | 0.61 | | 500 | 0.55 | --- ### 4. Part Number Breakdown Understanding the nomenclature helps in identifying variants: * **ATS:** Advanced Thermal Solutions (Brand). * **18F:** Part series/Geometry. * **38:** Width/Size category (approx 37-38mm). * **C2:** Material/Color (Blue Anodized). * **R0:** Packaging or TIM specification. ---