## Electronic Component Analysis: ATS-18F-36-C2-R0 The **ATS-18F-36-C2-R0** is a high-performance **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** series, specifically designed for cooling electronic components such as processors, FPGAs, and ASICs. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Property | Specification | Details | | :--- | :--- | :--- | | **Product Type** | Heat Sink | Passive cooling component | | **Material** | Aluminum | Blue Anodized finish | | **Attachment Method** | pushPIN™ | Spring-loaded brass pin assembly | | **Dimensions (L x W)** | 36.83mm x 36.83mm | Square footprint | | **Height** | 12.70mm | Low profile design | | **Thermal Resistance** | 4.82 °C/W | Measured @ 200 LFM (Linear Feet per Minute) | | **Fin Style** | Straight | Optimized for longitudinal airflow | --- ### 2. Key Features * **maxiFLOW™ Design:** Features a tapered fin pattern that maximizes surface area and increases air turbulence, significantly improving heat dissipation compared to standard square-cut heat sinks. * **pushPIN™ Attachment:** The "R0" suffix indicates the inclusion of a pushPIN™ mounting system. This provides a secure, vibration-resistant attachment to the PCB with a pre-assembled compression spring. * **Thermal Interface Material (TIM):** Typically comes with pre-applied **T766** thermal phase-change material or tape, ensuring high thermal conductivity between the component and the heat sink. --- ### 3. Electronic Application & Performance The ATS-18F-36-C2-R0 is engineered for high-density electronic packaging where space is limited but thermal loads are high. #### Thermal Resistance Table (Airflow Dependent) | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 4.82 | | 400 (2.0 m/s) | 2.93 | | 600 (3.0 m/s) | 2.31 | | 800 (4.0 m/s) | 2.01 | --- ### 4. Implementation Checklist When integrating this part into a circuit board design, consider the following: 1. **Hole Pattern:** The PCB must have specific drill holes to accommodate the pushPIN™ spacing (typically 36mm - 40mm pitch depending on the specific clip). 2. **Clearance:** Ensure no tall capacitors or connectors obstruct the "wings" of the maxiFLOW™ fin structure. 3. **Airflow Direction:** Because it uses straight fins, the heat sink must be oriented parallel to the system's fan airflow for maximum efficiency. ---