The **ATS-18F-35-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed for cooling high-power semiconductors. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (Extruded) | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 35mm x 35mm x 10mm | | **Thermal Resistance** | 12.01° C/W (@ 200 LFM) | | **Pressure Drop** | 0.20 in. H2O (@ 200 LFM) | | **Attachment Method** | pushPIN™ | | **Attachment Spring** | Brass (Nickel Plated) | | **TIM (Thermal Interface Material)** | T766 (Pre-applied) | --- ### 2. Electronic Component Features #### A. The maxiFLOW™ Design The "18F" series utilizes a unique **tapered fin design**. This geometry maximizes the surface area for heat dissipation while maintaining a high volume of airflow. It is particularly effective in constrained spaces where electronic components are packed tightly together. #### B. pushPIN™ Attachment System This component uses the **pushPIN™** mounting mechanism. Unlike adhesive tapes, this provides: * **Constant Pressure:** Ensures the thermal interface material (TIM) makes perfect contact with the electronic chip. * **Reliability:** Resistant to shock and vibration found in industrial or automotive environments. * **Compatibility:** Designed for PCB holes (pre-drilled) using standardized 0.126" (3.2mm) holes. #### C. Thermal Interface Material (T766) The part comes with **T766** pre-applied. In electronics, this is a phase-change material or high-performance grease that fills microscopic air gaps between the heat sink and the electronic package (e.g., CPU, FPGA, or GPU), significantly lowering the junction temperature. --- ### 3. Application Use Cases This heat sink is typically found in the following electronic sectors: 1. **Telecommunications:** Cooling network switches and routers. 2. **Computing:** Managing heat in embedded processors or memory modules. 3. **Industrial Controls:** Cooling power transistors and motor drivers. 4. **Automotive:** Managing thermal loads in ADAS or infotainment modules. ---