The **ATS-18F-32-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions, Inc. (ATS)*. It belongs to the **maxiFLOW™** product line, designed for cooling high-power semiconductors and integrated circuits. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Parameter | Specification | | :--- | :--- | | **Product Series** | maxiFLOW™ | | **Material** | Aluminum (Black Anodized) | | **Dimensions (L x W x H)** | 57mm x 57mm x 15mm | | **Mounting Style** | pushPIN™ | | **Attachment Type** | Push Pin (Brass) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 2.14 °C/W (@ 100 LFM) | | **Flow Orientation** | Fine-pitch Fins (High airflow) | --- ### 2. Core Features * **maxiFLOW™ Design:** Features a spread fin pattern that maximizes surface area for heat dissipation while maintaining a low pressure drop. * **pushPIN™ Attachment:** This system allows for secure mounting to a PCB without the need for tools. It includes a built-in compression spring to ensure even pressure across the component. * **Thermal Interface Material (TIM):** This specific model typically comes with **T766** pre-applied, which is a high-performance phase-change thermal pad. * **Material:** The aluminum construction provides a lightweight yet efficient thermal path, and the black anodized finish improves radiative heat transfer. --- ### 3. Applications The ATS-18F-32-C2-R0 is commonly used in the following electronic environments: 1. **Networking Hardware:** Cooling CPUs and ASICs in switches and routers. 2. **Embedded Systems:** High-performance computing boards where vertical clearance (15mm) is restricted. 3. **Power Electronics:** Dissipating heat from MOSFETs or IGBTs in power conversion modules. --- ### 4. Part Number Breakdown The suffixing in the part number provides specific configuration details: * **ATS-18:** Series Identifier. * **F:** Fin pitch/style. * **32:** Specific size/geometry code. * **C2:** Blue Anodized or specific thermal pad/attachment combo (In this series, C2 often denotes high-performance TIM). * **R0:** Revision code (Standard RoHS compliant version).