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  • ATS-18F-31-C2-R0

  • AI
    ### ATS-18F-31-C2-R0: Electronic Component Overview The **ATS-18F-31-C2-R0** is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **push-pin** attachment series, specifically designed for cooling electronic components such as CPUs, GPUs, and other high-heat integrated circuits. --- ### Technical Specifications | Feature | Details | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-18F-31-C2-R0 | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **Dimensions** | 57.9mm x 60.96mm x 12.7mm | | **Fin Style** | Straight Fin | | **Thermal Resistance** | 5.23°C/W (at 200 LFM) | --- ### Component Breakdown #### 1. Heat Sink Geometry The device uses a **straight fin** configuration. This design is optimized for environments with consistent, directed airflow. The fins increase the surface area available for heat dissipation through convection. #### 2. Attachment Mechanism (Push-Pins) The "R0" designation refers to the specific mounting hardware. * **Push-Pins:** These are pre-assembled with the heat sink to ensure quick and secure mounting to the PCB. * **Compression Springs:** These provide the necessary downward pressure to ensure an airtight thermal interface between the heat sink and the component. #### 3. Thermal Interface Material (TIM) The part comes pre-applied with **ATS-specific thermal grease** or a phase-change material. This eliminates the need for manual application, reducing the risk of air pockets that hinder heat transfer. #### 4. Material and Finish * **Aluminum:** Chosen for its excellent thermal conductivity-to-weight ratio. * **Blue Anodizing:** This is not just aesthetic; the anodized layer provides increased corrosion resistance and slight improvements in surface emissivity for radiative cooling. --- ### Typical Applications * **Networking Equipment:** Routers, switches, and base stations. * **Embedded Systems:** Single-board computers and industrial controllers. * **Power Electronics:** Voltage regulators and power converters requiring passive or active airflow cooling. ---
    ✨ Follow-up Questions
    • ⤷ What is the exact thermal resistance of this heat sink at high airflow (e.g.
    • ⤷ 600 LFM)?
    • ⤷ Are there different spring tension options available for the ATS-18 series?
    • ⤷ How does the straight fin design compare to a cross-cut fin design for this specific model?