ATS-18F-31-C2-R0
AI

### ATS-18F-31-C2-R0: Electronic Component Overview
The **ATS-18F-31-C2-R0** is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **push-pin** attachment series, specifically designed for cooling electronic components such as CPUs, GPUs, and other high-heat integrated circuits.
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### Technical Specifications
| Feature | Details |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Part Number** | ATS-18F-31-C2-R0 |
| **Material** | Aluminum (Blue Anodized) |
| **Attachment Method** | Push-Pin (Brass) |
| **Spring Type** | Compression Spring |
| **Dimensions** | 57.9mm x 60.96mm x 12.7mm |
| **Fin Style** | Straight Fin |
| **Thermal Resistance** | 5.23°C/W (at 200 LFM) |
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### Component Breakdown
#### 1. Heat Sink Geometry
The device uses a **straight fin** configuration. This design is optimized for environments with consistent, directed airflow. The fins increase the surface area available for heat dissipation through convection.
#### 2. Attachment Mechanism (Push-Pins)
The "R0" designation refers to the specific mounting hardware.
* **Push-Pins:** These are pre-assembled with the heat sink to ensure quick and secure mounting to the PCB.
* **Compression Springs:** These provide the necessary downward pressure to ensure an airtight thermal interface between the heat sink and the component.
#### 3. Thermal Interface Material (TIM)
The part comes pre-applied with **ATS-specific thermal grease** or a phase-change material. This eliminates the need for manual application, reducing the risk of air pockets that hinder heat transfer.
#### 4. Material and Finish
* **Aluminum:** Chosen for its excellent thermal conductivity-to-weight ratio.
* **Blue Anodizing:** This is not just aesthetic; the anodized layer provides increased corrosion resistance and slight improvements in surface emissivity for radiative cooling.
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### Typical Applications
* **Networking Equipment:** Routers, switches, and base stations.
* **Embedded Systems:** Single-board computers and industrial controllers.
* **Power Electronics:** Voltage regulators and power converters requiring passive or active airflow cooling.
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- ⤷
What is the exact thermal resistance of this heat sink at high airflow (e.g.
- ⤷ 600 LFM)?
- ⤷ Are there different spring tension options available for the ATS-18 series?
- ⤷ How does the straight fin design compare to a cross-cut fin design for this specific model?