ATS-18F-27-C2-R0
AI

The **ATS-18F-27-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions, Inc. (ATS)*. It belongs to the **pushPIN™** series, designed for secure and efficient cooling of electronic components like CPUs, GPUs, or FPGAs.
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## 1. Technical Specifications
The following table highlights the physical and thermal properties of this specific part:
| Characteristic | Specification |
| :--- | :--- |
| **Material** | Aluminum (Blue Anodized) |
| **Dimensions (L x W x H)** | 70mm x 70mm x 12.7mm |
| **Fin Style** | XC (Cross-cut) / Square |
| **Attachment Type** | pushPIN™ (Spring-loaded) |
| **Thermal Resistance** | 12.24 °C/W (at 100 LFM) |
| **Pressure Flow** | High-efficiency airflow design |
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## 2. Key Components & Features
### A. PushPIN™ Attachment Mechanism
Unlike adhesive tapes, this part uses a **pushPIN™** system which includes:
* **Brass/Steel Pins:** To secure the sink to the PCB.
* **Compression Springs:** Provides consistent pressure to ensure optimal contact with the heat source.
* **Vibration Resistance:** Ideal for industrial or automotive environments.
### B. Fin Design (XC Square)
The "XC" designation indicates a **Cross-cut** fin pattern. This design allows for:
* **Multi-directional Airflow:** It can dissipate heat effectively regardless of the direction the cooling fan is blowing.
* **Surface Area Maximization:** Despite the low 12.7mm profile, the cross-cutting increases the surface area for convection.
### C. Thermal Interface Material (TIM)
The part comes pre-applied with **T412 Phase Change Material**. This is a critical "electronic part" of the assembly that fills microscopic air gaps between the component and the heat sink to lower thermal impedance.
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## 3. Applications
The low-profile height (12.7mm) makes the ATS-18F-27-C2-R0 suitable for:
1. **1U Servers:** Fits within tight vertical spacing.
2. **Networking Equipment:** Used on high-speed switches and routers.
3. **Embedded Systems:** Industrial PCs where mechanical stability is required.
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- ⤷
What is the difference between pushPIN and adhesive heat sink mounting?
- ⤷ How does the 'Blue Anodized' finish affect thermal performance?
- ⤷ Is there a version of this heat sink with a higher profile for better cooling?