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  • ATS-18F-27-C2-R0

  • AI
    The **ATS-18F-27-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions, Inc. (ATS)*. It belongs to the **pushPIN™** series, designed for secure and efficient cooling of electronic components like CPUs, GPUs, or FPGAs. --- ## 1. Technical Specifications The following table highlights the physical and thermal properties of this specific part: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions (L x W x H)** | 70mm x 70mm x 12.7mm | | **Fin Style** | XC (Cross-cut) / Square | | **Attachment Type** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 12.24 °C/W (at 100 LFM) | | **Pressure Flow** | High-efficiency airflow design | --- ## 2. Key Components & Features ### A. PushPIN™ Attachment Mechanism Unlike adhesive tapes, this part uses a **pushPIN™** system which includes: * **Brass/Steel Pins:** To secure the sink to the PCB. * **Compression Springs:** Provides consistent pressure to ensure optimal contact with the heat source. * **Vibration Resistance:** Ideal for industrial or automotive environments. ### B. Fin Design (XC Square) The "XC" designation indicates a **Cross-cut** fin pattern. This design allows for: * **Multi-directional Airflow:** It can dissipate heat effectively regardless of the direction the cooling fan is blowing. * **Surface Area Maximization:** Despite the low 12.7mm profile, the cross-cutting increases the surface area for convection. ### C. Thermal Interface Material (TIM) The part comes pre-applied with **T412 Phase Change Material**. This is a critical "electronic part" of the assembly that fills microscopic air gaps between the component and the heat sink to lower thermal impedance. --- ## 3. Applications The low-profile height (12.7mm) makes the ATS-18F-27-C2-R0 suitable for: 1. **1U Servers:** Fits within tight vertical spacing. 2. **Networking Equipment:** Used on high-speed switches and routers. 3. **Embedded Systems:** Industrial PCs where mechanical stability is required. ---
    ✨ Follow-up Questions
    • ⤷ What is the difference between pushPIN and adhesive heat sink mounting?
    • ⤷ How does the 'Blue Anodized' finish affect thermal performance?
    • ⤷ Is there a version of this heat sink with a higher profile for better cooling?