The **ATS-18F-23-C2-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It is a high-performance heat sink designed for thermal management of electronic components like CPUs, GPUs, or high-power chipsets. --- ## 1. Component Specification Overview The part number follows a specific nomenclature that defines its dimensions, material, and thermal properties. | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Family** | pushPIN™ Heat Sink | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Standard) | | **Thermal Resistance** | 12.00°C/W (Unducted Flow) | --- ## 2. Detailed Technical Breakdown ### A. Dimensions and Geometry * **Base Dimensions:** 45mm x 45mm. * **Height:** 15mm (Low profile, suitable for space-constrained enclosures). * **Fin Type:** Cross-cut (designed for multi-directional airflow). ### B. The "pushPIN™" Mounting System The **-R0** suffix indicates the mounting hardware. This part uses a specialized push-pin system: * **Mechanism:** A spring-loaded pin that passes through pre-drilled holes in the PCB. * **Pressure:** Ensures consistent contact pressure between the heat sink and the component to optimize heat transfer. * **Compatibility:** Designed for specific hole patterns (usually 38mm x 38mm pitch for this size). ### C. Thermal Interface Material (TIM) * This model typically comes pre-applied with **Phase Change Material** or high-performance thermal grease to eliminate air gaps between the chip and the heat sink base. --- ## 3. Performance Characteristics The thermal efficiency of the ATS-18F-23-C2-R0 is dependent on the **Air Velocity** (measured in Feet Per Minute - LFM): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 12.01 | | 300 (1.5 m/s) | 4.22 | | 500 (2.5 m/s) | 2.96 | | 700 (3.5 m/s) | 2.40 | --- ## 4. Typical Applications * **Embedded Systems:** For cooling SoCs (System on Chips). * **Networking Gear:** Switches and routers where horizontal airflow is present. * **Power Supplies:** Cooling MOSFETs or power regulators.