The **ATS-18F-210-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" series, designed for cooling integrated circuits (ICs) like CPUs, GPUs, and FPGAs. --- ## 1. Technical Specifications Below are the primary physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions** | 70.00mm x 70.00mm | | **Height** | 15.00mm | | **Fin Type** | Straight Fin | | **Mounting Style** | pushPIN™ (Spring-loaded) | | **Attachment Type** | Push Pin (Plastic/Brass) | | **Thermal Resistance** | 0.60 °C/W (at 200 LFM) | --- ## 2. Component Breakdown ### A. Material and Coating The heat sink is made from **Aluminum**, which provides high thermal conductivity while remaining lightweight. The **Blue Anodized** finish is not just aesthetic; it increases the surface emissivity, slightly improving radiative heat transfer and providing corrosion resistance. ### B. Fin Geometry The "Straight Fin" design is optimized for **undirected airflow**. It allows for low pressure drops across the heat sink, making it ideal for systems with standard cooling fans. ### C. Attachment Mechanism (pushPIN™) The "R0" suffix refers to the specific attachment kit used. - **Push Pins:** These are inserted through pre-drilled holes in the PCB. - **Compression Springs:** These ensure a consistent, calculated pressure on the electronic component (TIM - Thermal Interface Material), which prevents damage to the silicon while maximizing heat transfer. --- ## 3. Thermal Performance Thermal resistance indicates how efficiently the heat sink moves heat away from the component. A lower value is better. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 2.41 | | 200 (1.0 m/s) | 0.60 | | 400 (2.0 m/s) | 0.43 | --- ## 4. Key Application Use-Cases * **Networking Equipment:** High-speed routers and switches. * **Embedded Systems:** Industrial PCs requiring passive or semi-active cooling. * **Power Electronics:** Cooling MOSFETs or power modules in flat enclosures. ---