The **ATS-18F-196-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) and other heat-generating components. ### 1. Technical Specifications The following table highlights the core physical and thermal properties of this specific part number: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-18F-196-C2-R0 | | **Series** | pushPIN™ | | **Heat Sink Type** | XCUT (Cross-Cut) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 45mm x 45mm x 10mm | | **Attachment Method** | Push-Pin (Spring Loaded) | | **Thermal Resistance** | 18.11°C/W (Natural Convection) | --- ### 2. Breakdown of the Part Number The nomenclature for ATS heat sinks provides specific details about the component's configuration: * **ATS-18**: Refers to the specific series or design family. * **F**: Indicates the attachment method/type (often related to the push-pin force). * **196**: A unique identifier for the physical size and fin arrangement. * **C2**: Specifies the material and finish (Aluminum with a Blue Anodized coating). * **R0**: Refers to the revision and packaging standard. --- ### 3. Key Features and Applications The **ATS-18F-196-C2-R0** is characterized by several engineering advantages: 1. **XCUT Design:** The "cross-cut" fin geometry allows for omnidirectional airflow. This is critical in systems where the direction of the cooling fan cannot be strictly controlled or where air enters from multiple angles. 2. **pushPIN™ Attachment:** It uses a spring-loaded push-pin mechanism. This ensures consistent pressure between the heat sink and the component, optimizing thermal transfer and making installation tool-less. 3. **Low Profile:** At only 10mm in height, it is ideal for compact electronic assemblies, such as blade servers, network switches, or thin industrial computers. 4. **Pre-applied Interface:** Most models in this series come with high-performance **Phase Change Material (PCM)** or thermal grease pre-applied to the base to eliminate the need for manual application. --- ### 4. Thermal Performance Comparison Thermal resistance ($R_{th}$) determines how effectively the part cools. Lower values are better. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 18.11 | | 400 (2.0 m/s) | 12.95 | | 600 (3.0 m/s) | 10.76 |