The **ATS-18F-192-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "Blue Anodized" series designed specifically for cooling electronic components like CPUs, GPUs, and FPGAs. --- ## 1. Technical Specifications Below is a breakdown of the physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 45mm x 45mm x 30mm | | **Attachment Method** | pushPIN™ | | **Thermal Resistance (Flow)** | 2.35°C/W @ 100 LFM | | **Thermal Resistance (Static)** | 0.79°C/W @ 700 LFM | | **Weight** | ~48 grams | --- ## 2. Key Electronic Features ### A. pushPIN™ Attachment System Unlike adhesive tapes or simple clips, this model uses the **pushPIN™ system**. This features a flexible spring mechanism that provides: * **Constant Pressure:** Ensures maximum contact between the heat sink and the electronic component (TIM efficiency). * **Secure Mounting:** Prevents the heat sink from shifting during vibration or shipping. * **Compatibility:** Designed for pre-drilled holes in PCBs (Printed Circuit Boards). ### B. Thermal Interface Material (TIM) The "C2" suffix indicates that the part comes pre-applied with **ATS-PPS-02** thermal interface material. This is a phase-change material that reduces the thermal resistance between the component die and the heat sink base. ### C. Cross-Cut Fin Design The heat sink features a **straight fin (cross-cut)** pattern. This design allows for: * **Multidirectional Airflow:** It can dissipate heat effectively regardless of which direction the fan is blowing relative to the sink. * **Low Pressure Drop:** Maximizes the efficiency of the system's cooling fans. --- ## 3. Part Number Decoding Understanding the nomenclature helps in identifying its specific configuration: | Segment | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions (Manufacturer) | | **18F** | Family/Series Type | | **192** | Specific Size/Fin Configuration | | **C2** | Thermal Interface Material (T766/ATS-PPS-02) | | **R0** | RoHS Compliant / Revision Status | --- ## 4. Typical Applications * **Power Supplies:** Cooling MOSFETs and voltage regulators. * **Embedded Systems:** High-heat generating processors in compact enclosures. * **Telecommunications:** Cooling ASICs in networking hardware.