The part number **ATS-18F-183-C2-R0** refers to a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). This specific model belongs to their *maxiFLOW™* product line, designed for cooling electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Dimensions (L x W x H)** | 40mm x 40mm x 20mm | | **Thermal Resistance** | 5.37°C/W (at 200 LFM) | | **Fin Style** | Straight (maxiFLOW™ tapered fin) | | **Thermal Interface Material** | T766 (Pre-applied phase-change material) | --- ### 2. Physical Design Components The "Electronic Part" consists of several integrated hardware sub-components that work together to manage heat: * **The Heat Sink Body:** Constructed from extruded aluminum. The blue anodized finish is not just for aesthetics; it provides surface protection and slightly increases emissivity for better radiation cooling. * **maxiFLOW™ Fin Profile:** Unlike standard square fins, these feature a tapered design. This geometry increases the surface area while reducing the pressure drop of the air flowing through it, making it highly efficient for forced-air cooling. * **pushPIN™ Attachment:** This is the mounting mechanism. It uses a plastic or brass pin combined with a stainless steel spring. This ensures a constant, calibrated pressure (force) against the electronic chip, which is critical for maximizing heat transfer. * **TIM (Thermal Interface Material):** The "C2" in the part number indicates it comes with **T766** pre-applied. This is a high-performance material that fills the microscopic air gaps between the chip and the heat sink base. --- ### 3. Part Number Breakdown The nomenclature follows a specific logic used by ATS: | Segment | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions (Manufacturer) | | **18F** | Part series / Fin design | | **183** | Dimensions and specific geometry code | | **C2** | Thermal Interface Material (T766 pre-applied) | | **R0** | RoHS compliance status / Revision | --- ### 4. Application This part is typically found in: * **Telecommunications:** Cooling ASICs or FPGAs. * **Power Supplies:** Managing heat for MOSFETs. * **Embedded Computing:** Cooling industrial-grade processors where space is limited but thermal loads are high.