The part number **ATS-18F-166-C3-R0** refers to a high-performance **Heatsink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "pushPIN™" component cooling series, designed specifically for cooling electronic components like CPUs, GPUs, or high-power ASICs. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this specific model: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 12.30 °C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W x H)** | 25mm x 25mm x 15mm | | **Fin Pattern** | Square (Fine Pitch) | | **TIM (Interface Material)** | T412 (High Performance) | --- ### 2. Breakdown of the Part Number The alphanumeric code follows a specific logic used by ATS to define the product's geometry and mounting style: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **18F**: Series designation (specific fin geometry and push-pin style). * **166**: Unique geometric identifier (Dimensions 25x25mm). * **C3**: Indicates the Thermal Interface Material (TIM) and finish. `C3` typically denotes Blue Anodized finish. * **R0**: Revision number or packaging code. --- ### 3. Key Electronic Cooling Features #### Thermal Management The heatsink is designed to dissipate heat from surface-mount components. At a low airflow of 100 LFM (Linear Feet per Minute), it provides a thermal resistance of **12.30 °C/W**, which drops significantly as airflow increases (e.g., down to **3.91 °C/W** at 700 LFM). #### The pushPIN™ System Unlike adhesive-based heatsinks, this model uses a mechanical mounting system: 1. **Spring-loaded Bolts:** Ensure consistent pressure across the component surface, maximizing thermal transfer. 2. **Reliability:** Mechanical attachment is preferred in high-vibration environments where thermal tape might fail. #### Pre-applied TIM The **T412** thermal interface material is pre-applied to the base. This is a "phase-change" or high-conductivity material that fills microscopic air gaps between the component die and the aluminum base. --- ### 4. Typical Applications * **Networking Hardware:** Switches and routers. * **Embedded Systems:** Industrial PCs and IoT gateways. * **Power Supplies:** Cooling MOSFETs or voltage regulators. * **FPGA/ASIC Cooling:** Small-form-factor chips requiring active or passive airflow.