ATS-18F-152-C2-R0
AI

The **ATS-18F-152-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the "blue ice" or high-performance push-pin series designed for cooling localized electronic components.
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## 1. Technical Specifications
Below are the primary physical and thermal characteristics of the component:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Plastic) |
| **Spring Type** | Compression Spring |
| **Thermal Resistance** | 3.32°C/W @ 100 LFM |
| **Dimensions (L x W x H)** | 35mm x 35mm x 25mm |
| **Fin Style** | Straight Fin |
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## 2. Component Breakdown
### A. Material and Coating
The part is made of **Aluminum 6063**, which offers high thermal conductivity. The **Blue Anodized** coating is not just for aesthetics; it provides surface protection against corrosion and increases thermal emissivity, slightly improving heat dissipation.
### B. The Mounting Mechanism (Push-Pin)
The "C2" in the part number indicates the specific hardware used:
* **Plastic Push-Pins:** Allows for quick and easy installation into pre-drilled holes on a PCB.
* **Compression Springs:** Ensures consistent downward pressure on the component (CPU, GPU, or MOSFET), which is critical for maximizing contact and heat transfer through the thermal interface material (TIM).
### C. Thermal Performance
The heat sink is designed for **forced air** environments. Its thermal resistance decreases as airflow (Measured in Linear Feet per Minute - LFM) increases:
* **100 LFM:** 3.32°C/W
* **200 LFM:** 2.11°C/W
* **400 LFM:** 1.57°C/W
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## 3. Applications
This specific size and mounting style are commonly used for:
1. **Processors:** Low-power CPUs or secondary chipsets.
2. **Network Hardware:** Cooling ASICs in switches and routers.
3. **Power Electronics:** Cooling large transistors or power modules.
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## 4. Part Number Decoding (Example)
The part number follows the ATS standard nomenclature:
| Segment | Meaning |
| :--- | :--- |
| **ATS** | Advanced Thermal Solutions |
| **18F** | Series/Geometry |
| **152** | Specific Fin Pattern/Height Code |
| **C2** | Hardware Kit (Push-Pin + Spring) |
| **R0** | RoHS Compliant Version |
- ⤷What type of thermal interface material (TIM) is recommended for this heat sink?
- ⤷ How do I calculate if the 35mm footprint fits my specific PCB layout?
- ⤷ What are the alternatives to push-pin mounting for this size of heat sink?