The **ATS-18F-149-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "blue ICE" series, designed for cooling electronic components like BGA (Ball Grid Array) chips, CPUs, and GPUs. --- ### 1. Technical Specifications The part number provides specific data regarding its size, material, and thermal properties. | Specification | Value | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Base Dimensions** | 35mm x 35mm | | **Height** | 20mm | | **Attachment Method** | Push-pin (Spring-loaded) | | **Thermal Resistance** | 3.95°C/W (at 200 LFM) | | **Material** | Aluminum | | **Finish** | Blue Anodized | --- ### 2. Breakdown of the Part Number The nomenclature defines the exact physical characteristics of the heat sink: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **18F**: Indicates the specific fin pattern and series type. * **149**: Internal reference for the specific model size (35mm x 35mm). * **C2**: Refers to the thermal interface material (TIM) or the specific coating/finish. * **R0**: Revision/Release code indicating the standard manufacturing version. --- ### 3. Key Electronic Components Features #### A. Thermal Management The primary purpose of this part is to dissipate heat from integrated circuits (ICs). With a thermal resistance of **3.95°C/W** under moderate airflow, it prevents thermal throttling and hardware failure in sensitive electronics. #### B. The Push-Pin Mechanism Unlike adhesive-based heat sinks, the `ATS-18F-149-C2-R0` uses a mechanical push-pin system. * **Spring-loaded:** Ensures consistent pressure across the surface of the chip. * **Hole Pattern:** Requires pre-drilled holes in the PCB for mounting. * **Stability:** Offers better vibration resistance than double-sided thermal tape. #### C. Fin Design It utilizes a **Fine Pitch** fin design. This increases the total surface area for heat exchange, making it highly efficient in forced-air environments (systems with fans). --- ### 4. Applications This specific heat sink is commonly found in: 1. **Networking Hardware:** Switches, routers, and gateways. 2. **Embedded Systems:** Industrial PCs and controllers. 3. **Power Electronics:** Voltage regulators and high-speed processors.