The **ATS-18F-101-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It is part of the "push-pin" series designed for securing the thermal solution directly to a Printed Circuit Board (PCB). --- ## Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Product Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Thermal Resistance** | 6.77°C/W (at 100 LFM) | | **Fin Style** | Straight (Fine Pitch) | --- ## Key Components & Physical Dimensions The part is engineered for precision cooling in compact electronic assemblies. ### 1. Physical Dimensions * **Length:** 45.00 mm * **Width:** 45.00 mm * **Height:** 30.00 mm * **Hole Spacing:** 38.00 mm (center-to-center) ### 2. Attachment System (Push-Pins) The "R0" designation refers to the specific attachment hardware. It uses a **brass or plastic push-pin with a stainless steel spring**. This provides: * **Consistent Pressure:** Ensures the thermal interface material (TIM) is compressed evenly against the component (CPU/GPU/FPGA). * **Secure Mounting:** Reduces the risk of the heat sink shifting during mechanical shock or vibration. ### 3. Thermal Interface Material (TIM) The "C3" in the part number indicates that this model typically comes with **pre-applied T766 Phase Change Material** or similar high-performance grease. This eliminates the need for manual thermal paste application. --- ## Performance Characteristics The thermal efficiency of the ATS-18F-101-C3-R0 depends heavily on the airflow (measured in Linear Feet per Minute - LFM): | Airflow Velocity | Thermal Resistance (Unducted) | | :--- | :--- | | 100 LFM (0.5 m/s) | 6.77 °C/W | | 300 LFM (1.5 m/s) | 2.50 °C/W | | 500 LFM (2.5 m/s) | 1.84 °C/W | ### Summary of Benefits * **Aerodynamic Fin Design:** Optimizes airflow through the fins to maximize heat dissipation. * **Ease of Assembly:** The push-pin design allows for rapid installation on high-volume production lines. * **Lightweight:** Being aluminum, it provides excellent thermal conductivity without adding excessive weight to the PCB.