The **ATS-18F-101-C2-R0** is a high-performance heat sink manufactured by *Advanced Thermal Solutions (ATS)*, specifically designed for cooling electronic components such as CPUs, GPUs, and power modules. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions** | 45mm x 45mm x 30mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 6.69°C/W (Unducted @ 100 LFM) | | **Flow Orientation** | Vertical Fin (Cross-cut) | --- ### 2. Key Design Elements #### A. The pushPIN™ Attachment System This part uses a proprietary attachment mechanism consisting of a brass or plastic pin and a high-performance compression spring. * **Security:** Provides precise pressure (Force) to the component for optimal thermal transfer. * **Mounting:** Requires pre-drilled holes in the PCB. #### B. Cross-Cut Fin Pattern Unlike standard extruded heat sinks with long straight fins, this model features a **cross-cut** design. This allows for: * **Omnidirectional Airflow:** It can accept air from any direction, making it ideal for cramped electronic enclosures where airflow paths are unpredictable. * **Increased Surface Area:** The individual "pins" or blocks created by the cross-cuts increase the total cooling surface. #### C. Thermal Interface Material (TIM) The "R0" at the end of the part number typically indicates that the unit comes pre-applied with **T766** phase-change material or a high-performance thermal tape/pad, ensuring no additional thermal paste is required during assembly. --- ### 3. Part Number Breakdown The part number follows a specific nomenclature used by ATS: * **ATS-18:** Series designation. * **F:** Fin pitch/style. * **101:** Specific physical dimensions and hole pattern. * **C2:** Blue Anodized finish. * **R0:** Revision/Packaging and Thermal Interface type. --- ### 4. Applications This electronic part is commonly used in: 1. **Telecommunications:** Cooling ASICs in networking switches. 2. **Industrial PCs:** Heat dissipation for embedded processors. 3. **Power Supplies:** Managing heat for high-output MOSFETs or IGBTs.