The **ATS-18E-143-C3-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **push-pin** attachment series designed for cooling electronic components such as processors, FPGAs, and ASICs. ### 1. Technical Specifications The part number encodes specific physical and thermal characteristics. Here is the breakdown: | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-18E-143-C3-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Flow Orientation** | Vertical Fin (Straight) | | **Thermal Resistance** | ~7.40°C/W (Unducted @ 200 LFM) | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 20.00mm | --- ### 2. Component Design & Materials * **Heat Sink Body:** Constructed from high-quality aluminum to provide a lightweight yet effective thermal conductor. * **Fin Style:** It utilizes a **straight-fin** design. This is optimized for environments where there is a clear, directional airflow (forced convection). * **Thermal Interface Material (TIM):** This specific model typically comes pre-applied with **T412**, a high-performance thermal tape or phase-change material, ensuring minimal air gaps between the chip and the metal. * **Blue Anodized Coating:** The blue finish isn't just aesthetic; anodization increases the surface emissivity, slightly improving radiant heat transfer and protecting the aluminum from corrosion. --- ### 3. Mounting Mechanism (Push-Pin) The "Push-Pin" system is a mechanical attachment method that offers several advantages over simple adhesive: 1. **Consistent Pressure:** The built-in springs ensure a constant downward force on the component, optimizing the thermal interface. 2. **Reliability:** Unlike tape, which can dry out or lose grip over time due to heat cycles, a mechanical pin through the PCB remains secure. 3. **Hole Pattern:** This part requires pre-drilled holes in the PCB. The specific pitch (distance between holes) for the 143 series is usually tailored for specific industry-standard chip footprints. --- ### 4. Thermal Performance Context Thermal resistance is measured in **°C/W** (degrees Celsius per Watt). A lower number is better. * **At 200 LFM (Linear Feet per Minute):** 7.40°C/W. * **At 500 LFM:** The resistance drops significantly (approx. 3.60°C/W), meaning the part becomes much more efficient as fan speed increases.