The **ATS-18D-97-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications Below is the technical breakdown of the part number and its physical characteristics: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Attachment Method** | Push-Pin (with Compression Springs) | | **Dimensions** | 45mm x 45mm x 10mm | | **Thermal Resistance** | 20.30 °C/W (Unducted Flow) | | **Finish** | Blue Anodized | | **Compliance** | RoHS and REACH Compliant | --- ### 2. Key Electronic Components Features #### A. The "pushPIN™" Attachment System This heat sink utilizes a specialized push-pin mechanism. In PCB design, this means the board must have pre-drilled holes to accommodate the pins. The compression springs ensure that a constant, specific pressure is applied to the electronic component, maximizing thermal interface contact. #### B. Fins and Geometry The "97" in the part number refers to the specific fin pattern. This model features **straight fins**, which are optimized for environments where there is a consistent directional airflow (ducted or fan-driven). #### C. Thermal Performance The efficiency of this part is measured by its thermal resistance. At lower airflow (200 LFM), the resistance drops significantly (around 6.00 °C/W), allowing the electronic component underneath to remain within its Safe Operating Area (SOA). --- ### 3. Application Use Cases * **High-Speed Networking:** Cooling for ASICs in switches and routers. * **Embedded Systems:** Heat dissipation for industrial ARM or x86 processors. * **Power Electronics:** Cooling MOSFET arrays or DC-DC converters on a PCB. --- ### 4. Mounting Hardware The part typically comes with: 1. **Brass or Plastic Pins:** To secure the unit to the PCB. 2. **Stainless Steel Springs:** To maintain the attachment force. 3. **Thermal Interface Material (TIM):** Often pre-applied (T766 or similar) to bridge the air gap between the heat sink and the chip.