The **ATS-18D-96-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to dissipate heat from electronic components like CPUs, GPUs, or FPGAs. --- ## 1. Technical Specifications The following table highlights the critical mechanical and thermal properties of this part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 30.00mm | | **Attachment Method** | pushPIN™ | | **Thermal Resistance** | 5.63°C/W (at 100 LFM) | | **Airflow Path** | Straight Fin | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ## 2. Key Component Features ### A. maxiFLOW™ Design The "96" in the part number indicates the specific fin pattern. The maxiFLOW™ design features a flared fin structure that increases the surface area for heat dissipation while maintaining a low pressure drop. This is ideal for high-velocity airflow environments. ### B. pushPIN™ Attachment Instead of messy adhesives or fragile clips, this model uses a **pushPIN™** system. * **Springs:** Provides consistent pressure to ensure the Thermal Interface Material (TIM) makes perfect contact with the heat source. * **Hardware:** Usually consists of brass or plastic pins that lock into pre-drilled holes on the PCB. ### C. Blue Anodized Finish The surface is treated with a blue anodized coating. While visually distinct, the primary electronic/thermal benefit is **increased emissivity** and protection against corrosion, ensuring long-term reliability in industrial environments. --- ## 3. Thermal Performance Profile Thermal resistance determines how effectively the part moves heat away from the silicon. Performance varies based on air velocity: | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 5.63 | | 300 (1.5 m/s) | 2.10 | | 500 (2.5 m/s) | 1.44 | --- ### Application Summary This part is typically found on **Medium-sized ICs** (Integrated Circuits) such as: * Networking Switches and Routers. * Power Supplies. * Embedded Computing Modules.