The **ATS-18D-82-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to dissipate heat from integrated circuits like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to define its physical and thermal characteristics. | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Attachment Method** | pushPIN™ (Brass Pins with Stainless Steel Springs) | | **Material** | Aluminum (with Blue Anodized Finish) | | **Base Dimensions** | 30.00mm x 30.00mm | | **Height** | 25.00mm | | **Thermal Resistance** | 10.79°C/W (at 100 LFM) to 2.29°C/W (at 700 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Features #### A. maxiFLOW™ Fin Design The heat sink features a unique **flared fin** geometry. This design maximizes the surface area for cooling while reducing the pressure drop across the component. It is highly effective in environments where there is constrained airflow. #### B. pushPIN™ Attachment Instead of using messy adhesives or thermal tape, this part uses the **pushPIN™** system: * **Ease of Installation:** Uses pre-drilled holes in the PCB. * **Constant Pressure:** The compression springs ensure a firm, consistent contact between the heat sink and the electronic component, optimizing heat transfer. * **Reliability:** Resistant to shock and vibration compared to stick-on solutions. #### C. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied. This is a high-performance thermal grease/pad that fills microscopic air gaps between the chip and the heat sink base, significantly reducing thermal impedance. --- ### 3. Application Use Cases This specific model is generally used for small to medium-sized electronic packages: * **Networking Hardware:** Routers, switches, and high-speed modems. * **Embedded Systems:** Industrial PCs and single-board computers. * **Power Supplies:** Cooling voltage regulators or MOSFETs. * **Telecom:** Line cards and base station equipment. --- ### 4. Thermal Performance Comparison The effectiveness of this part scales with the velocity of air (Linear Feet per Minute - LFM): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **100** | 10.79 | | **300** | 4.43 | | **500** | 2.87 | | **700** | 2.29 |