The **ATS-18D-76-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. Below is a detailed breakdown of its specifications and design features. --- ### 1. Technical Specifications The part belongs to the **pushPIN™** series, designed for easy installation and high thermal efficiency on Printed Circuit Boards (PCBs). | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Type** | Push-Pin (Spring-loaded) | | **Thermal Resistance** | 11.57 °C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 25.00mm x 25.00mm x 15.00mm | --- ### 2. Physical Design & Dimensions The physical footprint is compact, making it ideal for high-density electronic assemblies. * **Footprint (X-Y):** 25mm x 25mm. * **Height (Z):** 15mm (Low profile for height-restricted enclosures). * **Hole Pattern:** 30mm center-to-center for mounting. * **Fin Style:** **Fine-Pitch** design. This provides a larger surface area relative to its size, which is critical for cooling chips with high heat density. --- ### 3. Thermal Performance (LFM - Linear Feet per Minute) The efficiency of the heat sink changes based on the airflow (forced convection) within the system: | Air Velocity (LFM) | 100 | 200 | 300 | 400 | 500 | 600 | 700 | | :--- | :--- | :--- | :--- | :--- | :--- | :--- | :--- | | **Unducted Flow (°C/W)** | 11.57 | 4.48 | 3.03 | 2.47 | 2.14 | 1.91 | 1.74 | | **Ducted Flow (°C/W)** | 2.96 | 2.08 | 1.76 | 1.57 | 1.44 | 1.34 | 1.25 | --- ### 4. Mounting Mechanism (pushPIN™) The "R0" suffix indicates the specific mounting kit. * **Attachment:** The part uses a push-pin and spring mechanism. This ensures a consistent pressure (Force) across the component, optimizing the thermal interface material (TIM) performance. * **Interface Material:** Usually comes pre-applied with a **T766 Phase Change Material**, which fills microscopic air gaps between the chip and the heat sink. --- ### 5. Common Applications This specific size and performance profile are commonly used for: * **BGA (Ball Grid Array) Chips:** Small processors or FPGAs. * **Telecommunications:** Cooling network switches or routers. * **Power Supplies:** Heat dissipation for voltage regulators.