The **ATS-18D-70-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ## 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-18D-70-C2-R0 | | **Type** | Board Level / BGA Heat Sink | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 25.00mm | | **Thermal Resistance** | 0.87°C/W (@ 100 LFM) | | **Mounting Hardware** | Included (Brass Springs/Plastic Pins) | --- ## 2. Key Design Features ### A. pushPIN™ Attachment System This part utilizes a specialized mounting mechanism designed to ensure reliable pressure on the component. * **Uniform Pressure:** Prevents "tilting" of the heat sink, ensuring the thermal interface material (TIM) makes perfect contact. * **Pre-assembled:** It usually comes with the spring-loaded pins pre-installed for fast assembly. ### B. Fin Design The "70" series often features a **Cross-Cut fin pattern**. * This design allows for multi-directional airflow, meaning the heat sink remains efficient even if the cooling fan is not perfectly aligned with the fins. ### C. Thermal Performance With a thermal resistance of approximately **0.87°C/W** at low airflow (100 LFM), this is a high-efficiency cooler capable of handling significant thermal loads in a compact 45mm footprint. --- ## 3. Material and Environmental Compliance * **Aluminum (6063):** Chosen for its excellent thermal conductivity and lightweight properties. * **Blue Anodized Finish:** Provides corrosion resistance and slightly improves radiative cooling. * **RoHS Compliant:** The product meets environmental standards for lead and other hazardous substances. --- ## 4. Typical Applications * **Networking Equipment:** Switches, routers, and high-speed hubs. * **Industrial PCs:** Compact systems requiring passive or active forced-air cooling. * **Power Supplies:** Cooling MOSFETs or power ICs.