The **ATS-18D-68-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The model number provides specific details about its design and material composition. | Parameter | Specification | |:---|:---| | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions** | 45mm x 45mm x 15mm | | **Thermal Resistance** | 15.31°C/W (Unducted Flow @ 100 LFM) | | **Thermal Interface Material (TIM)** | T766 (High performance) | --- ### 2. Key Design Features * **Heat Sink Profile:** It features a "Cross-Cut" or "Straight Fin" design (depending on the specific sub-series) optimized for either natural convection or forced air cooling. * **pushPIN™ Technology:** This part uses a specialized attachment mechanism that includes a flexible spring and a push-pin. This ensures even pressure across the component surface, improving heat transfer. * **Material Choice:** Aluminum is used for its excellent thermal conductivity-to-weight ratio. The blue anodized finish provides corrosion resistance and improves emissivity. * **Pre-Applied TIM:** It comes with **T766 thermal interface material** already applied to the base, ensuring a reliable thermal bond out of the box without the need for additional thermal paste. --- ### 3. Thermal Performance Comparison Thermal resistance varies based on air velocity (measured in Linear Feet per Minute - LFM): | Air Velocity (LFM) | Thermal Resistance (°C/W) | |:---:|:---:| | 100 (0.5 m/s) | 15.31 | | 300 (1.5 m/s) | 5.81 | | 500 (2.5 m/s) | 4.08 | --- ### 4. Common Applications * **Embedded Systems:** Cooling small form-factor industrial PCs. * **Telecommunications:** Dissipating heat from high-speed network switches. * **Power Electronics:** Managing heat for voltage regulators and power modules.