ATS-18D-66-C2-R0
AI

The **ATS-18D-66-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to their "blue ice" or high-performance maxiFLOW™ product line.
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## 1. Technical Specifications
The part number follows a specific nomenclature that defines its physical and thermal characteristics.
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum (High Performance) |
| **Finish** | Blue Anodized |
| **Dimensions** | 45mm x 45mm |
| **Height** | 25mm |
| **Attachment Method** | pushPIN™ (Spring-loaded pins) |
| **Thermal Resistance** | ~5.77° C/W (at 200 LFM) |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied) |
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## 2. Key Electronic Components
### A. The Heat Sink Body
The body is designed with a **spread-fin pattern**. Unlike traditional straight-fin heat sinks, the maxiFLOW™ design features a flared fin geometry. This increases the surface area for heat dissipation while maximizing airflow through the fin field, reducing the "pressure drop" across the component.
### B. pushPIN™ Attachment System
Instead of using messy adhesives or weak clips, the **-R0** designation typically indicates a push-pin assembly.
* **Springs:** Provides consistent pressure (downward force) on the electronic chip (e.g., FPGA, CPU, or GPU).
* **Plastic/Brass Pins:** Inserted into pre-drilled holes in the PCB to lock the heat sink in place.
### C. Thermal Interface Material (TIM)
The **-C2** portion of the code refers to the thermal interface. This model comes with **T766** pre-applied to the base. This is a phase-change material or high-conductivity grease that fills microscopic air gaps between the electronic component and the aluminum heat sink to ensure maximum heat transfer.
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## 3. Application Use Cases
This specific part is used to cool medium-to-large integrated circuits (ICs) that generate significant heat during operation:
* **Telecommunications:** Network switches and routers.
* **Computing:** High-speed data processing units.
* **Embedded Systems:** Industrial controllers and power supplies.
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## 4. Part Number Breakdown
| Segment | Meaning |
| :--- | :--- |
| **ATS** | Manufacturer (Advanced Thermal Solutions) |
| **18D** | Series (pushPIN™ Attachment type) |
| **66** | Specific Fin and Body geometry code |
| **C2** | Thermal Interface Material (T766) |
| **R0** | Revision/Packaging standard |
- ⤷
What is the exact thermal resistance of this heat sink at different airflow speeds (LFM)?
- ⤷ How do I calculate the required PCB hole size for the pushPIN attachment?
- ⤷ Are there alternative Thermal Interface Materials available for this specific model?