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  • ATS-18D-66-C2-R0

  • AI
    The **ATS-18D-66-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to their "blue ice" or high-performance maxiFLOW™ product line. --- ## 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (High Performance) | | **Finish** | Blue Anodized | | **Dimensions** | 45mm x 45mm | | **Height** | 25mm | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Thermal Resistance** | ~5.77° C/W (at 200 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ## 2. Key Electronic Components ### A. The Heat Sink Body The body is designed with a **spread-fin pattern**. Unlike traditional straight-fin heat sinks, the maxiFLOW™ design features a flared fin geometry. This increases the surface area for heat dissipation while maximizing airflow through the fin field, reducing the "pressure drop" across the component. ### B. pushPIN™ Attachment System Instead of using messy adhesives or weak clips, the **-R0** designation typically indicates a push-pin assembly. * **Springs:** Provides consistent pressure (downward force) on the electronic chip (e.g., FPGA, CPU, or GPU). * **Plastic/Brass Pins:** Inserted into pre-drilled holes in the PCB to lock the heat sink in place. ### C. Thermal Interface Material (TIM) The **-C2** portion of the code refers to the thermal interface. This model comes with **T766** pre-applied to the base. This is a phase-change material or high-conductivity grease that fills microscopic air gaps between the electronic component and the aluminum heat sink to ensure maximum heat transfer. --- ## 3. Application Use Cases This specific part is used to cool medium-to-large integrated circuits (ICs) that generate significant heat during operation: * **Telecommunications:** Network switches and routers. * **Computing:** High-speed data processing units. * **Embedded Systems:** Industrial controllers and power supplies. --- ## 4. Part Number Breakdown | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **18D** | Series (pushPIN™ Attachment type) | | **66** | Specific Fin and Body geometry code | | **C2** | Thermal Interface Material (T766) | | **R0** | Revision/Packaging standard |
    ✨ Follow-up Questions
    • ⤷ What is the exact thermal resistance of this heat sink at different airflow speeds (LFM)?
    • ⤷ How do I calculate the required PCB hole size for the pushPIN attachment?
    • ⤷ Are there alternative Thermal Interface Materials available for this specific model?