The **ATS-18D-65-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to describe its physical and thermal properties. | Feature | Specification | Details | | :--- | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | Part of the "pushPIN™" Series | | **Material** | Aluminum | Lightweight with high thermal conductivity | | **Finish** | Blue Anodized | Protects against corrosion and increases emissivity | | **Attachment Method** | pushPIN™ | Uses a spring-loaded pin for secure mounting | | **Base Dimensions** | 45mm x 45mm | Standard square footprint | | **Height** | 30.00mm | Vertical clearance required | | **Thermal Resistance** | 1.91°C/W (at 100 LFM) | Lower is better for heat dissipation | --- ### 2. Key Components & Design #### A. pushPIN™ Attachment System This part features a specialized mounting mechanism. Instead of adhesive tape, it uses pre-assembled **spring-loaded pins**. * **Pressure:** Ensures consistent contact pressure between the heat sink and the component. * **Stability:** Features 4-corner mounting to prevent tilting or uneven cooling. #### B. High-Performance Thermal Interface Material (TIM) The "C2" in the part number indicates that it comes with **T766 Phase Change Material**. This is a thermal grease/pad applied to the base that fills microscopic air gaps between the heat sink and the chip to maximize heat transfer. #### C. Fin Geometry The "D" in the series usually denotes a specific fin pattern (Cross-cut or straight) designed to maximize surface area while allowing airflow to pass through with minimal resistance (Pressure Drop). --- ### 3. Application Use Cases This specific heat sink is typically found in: * **Telecommunications:** High-speed routers and switches. * **Industrial PCs:** Computers operating in high-ambient temperature environments. * **Power Supplies:** Cooling MOSFETs and power regulators. * **Embedded Systems:** High-performance ARM or FPGA boards. --- ### 4. Thermal Performance Data *Measured at different airflow rates (LFM = Linear Feet per Minute):* | Airflow Velocity | 100 LFM | 300 LFM | 500 LFM | | :--- | :--- | :--- | :--- | | **Thermal Resistance** | 1.91 °C/W | 1.05 °C/W | 0.82 °C/W |