ATS-18D-59-C2-R0
AI

## Technical Overview: ATS-18D-59-C2-R0
The **ATS-18D-59-C2-R0** is a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push pin" series designed for cooling electronic components like CPUs, GPUs, and other high-heat integrated circuits.
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### 1. Key Specifications
The following table summarizes the physical and thermal properties of the component:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push Pin (Brass) |
| **Spring Type** | Compression Spring |
| **Thermal Resistance** | 7.94° C/W (@ 100 LFM) |
| **Dimensions (L x W x H)** | 40mm x 40mm x 30mm |
| **Fin Style** | Straight Fin |
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### 2. Electronic Component Breakdown
#### A. Thermal Management (Heat Dissipation)
This part is a **passive cooling component**. Its primary function is to increase the surface area of a heat-generating electronic device.
* **Thermal Interface Material (TIM):** This specific model comes pre-applied with **SAINT-GOBAIN C8000**, a high-performance thermal pad that ensures efficient heat transfer from the chip to the aluminum base.
#### B. The "Push Pin" Mechanism
Unlike adhesive-based heat sinks, the **ATS-18D-59-C2-R0** uses a mechanical attachment:
* **Push Pins:** Made of brass, these fit into pre-drilled holes in the Printed Circuit Board (PCB).
* **Compression Springs:** These ensure constant, even pressure across the surface of the electronic component, preventing gaps that could lead to overheating.
#### C. Airflow Design (Straight Fin)
The **straight fin** geometry is optimized for **longitudinal airflow**. In a server or desktop environment, fans blow air through these channels to carry heat away via convection.
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### 3. Part Number Decoding
The part number provides specific manufacturing details:
* **ATS:** Advanced Thermal Solutions (Manufacturer).
* **18D:** Series designation.
* **59:** Specific size/footprint code.
* **C2:** Refers to the thermal performance and material grade.
* **R0:** RoHS compliance status (lead-free).
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- ⤷
What are the specific PCB hole size requirements for the brass push pins in this model?
- ⤷ How does the thermal resistance of this heat sink change at higher airflows (e.g.
- ⤷ 500 LFM)?
- ⤷ Can the pre-applied thermal interface material (C8000) be replaced with thermal paste?