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  • ATS-18D-59-C2-R0

  • AI
    ## Technical Overview: ATS-18D-59-C2-R0 The **ATS-18D-59-C2-R0** is a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push pin" series designed for cooling electronic components like CPUs, GPUs, and other high-heat integrated circuits. --- ### 1. Key Specifications The following table summarizes the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Brass) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 7.94° C/W (@ 100 LFM) | | **Dimensions (L x W x H)** | 40mm x 40mm x 30mm | | **Fin Style** | Straight Fin | --- ### 2. Electronic Component Breakdown #### A. Thermal Management (Heat Dissipation) This part is a **passive cooling component**. Its primary function is to increase the surface area of a heat-generating electronic device. * **Thermal Interface Material (TIM):** This specific model comes pre-applied with **SAINT-GOBAIN C8000**, a high-performance thermal pad that ensures efficient heat transfer from the chip to the aluminum base. #### B. The "Push Pin" Mechanism Unlike adhesive-based heat sinks, the **ATS-18D-59-C2-R0** uses a mechanical attachment: * **Push Pins:** Made of brass, these fit into pre-drilled holes in the Printed Circuit Board (PCB). * **Compression Springs:** These ensure constant, even pressure across the surface of the electronic component, preventing gaps that could lead to overheating. #### C. Airflow Design (Straight Fin) The **straight fin** geometry is optimized for **longitudinal airflow**. In a server or desktop environment, fans blow air through these channels to carry heat away via convection. --- ### 3. Part Number Decoding The part number provides specific manufacturing details: * **ATS:** Advanced Thermal Solutions (Manufacturer). * **18D:** Series designation. * **59:** Specific size/footprint code. * **C2:** Refers to the thermal performance and material grade. * **R0:** RoHS compliance status (lead-free). ---
    ✨ Follow-up Questions
    • ⤷ What are the specific PCB hole size requirements for the brass push pins in this model?
    • ⤷ How does the thermal resistance of this heat sink change at higher airflows (e.g.
    • ⤷ 500 LFM)?
    • ⤷ Can the pre-applied thermal interface material (C8000) be replaced with thermal paste?