The **ATS-18D-50-C2-R0** is a specific high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "Blue" line of heat sinks designed for electronic cooling applications. Below is a breakdown of its technical specifications and features. --- ## 1. Technical Specifications | Specification | Value | | :--- | :--- | | **Part Number** | ATS-18D-50-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 15.00mm | | **Fin Style** | Fine-Pitch (Straight Fin) | | **Thermal Resistance** | 19.03 °C/W @ 100 LFM | | **Pressure Drop** | 0.10 in. H2O @ 200 LFM | --- ## 2. Key Electronic Components & Features ### A. Material and Thermal Conductivity The unit is made from high-grade aluminum. The **Blue Anodized** finish is not just for aesthetics; it provides surface protection against corrosion and slightly increases emissivity, which improves heat radiation in low-airflow environments. ### B. pushPIN™ Attachment System This heat sink uses the proprietary ATS **pushPIN™** system. This is a critical mechanical part for electronics because: * It ensures a precise, high-pressure fit against the chip. * The built-in springs allow for uniform pressure, preventing damage to delicate BGA (Ball Grid Array) components. * It is designed for easy installation and is compatible with pre-drilled holes in the PCB. ### C. Fin Geometry The "D" in the part number indicates a specific fin pattern designed for high-density cooling. The straight-fin design is optimized for environments where there is a consistent directional airflow, allowing air to pass through the gaps and wick heat away from the base plate. ### D. Thermal Interface Material (TIM) The "C2" suffix typically denotes that the heat sink comes pre-applied with a thermal interface material (like T766 or similar). This eliminates the need for manual thermal paste application and ensures optimal heat transfer between the electronic component and the heat sink. --- ## 3. Common Applications This heat sink is typically found on the following electronic components: 1. **Processors (CPUs/GPUs):** For low-power embedded systems. 2. **ASICs and FPGAs:** Used in telecommunications and data processing hardware. 3. **Power Electronics:** Voltage regulators and motor drivers that generate localized heat. ---