The **ATS-18D-47-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). ### 1. Technical Specifications The part is designed for cooling electronic components like CPUs, GPUs, or high-power semiconductors. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 9.30°C/W (Unducted Flow @ 100 LFM) | | **Attachment Method** | Push-Pin (Brass) | | **Dimensions (L x W x H)** | 25mm x 25mm x 20mm | | **Fin Type** | Straight | | **Interface Material** | T766 (Thermal Grease) | --- ### 2. Physical Design Elements * **Straight Fin Design:** This part utilizes a straight fin pattern, which is optimized for airflow traveling in a single direction across the board. * **Compact Footprint:** At 25mm x 25mm, it is designed for small-form-factor PCBs where space is limited. * **Blue Anodized Finish:** Beyond aesthetics, the anodized coating increases surface area slightly at the microscopic level and provides corrosion resistance and electrical insulation. ### 3. Mounting and Interface * **Push-Pin Mechanism:** The "18D" designation indicates the specific push-pin and spring kit used. This provides consistent pressure (preload) against the heat source, ensuring optimal thermal transfer without over-stressing the PCB. * **Thermal Interface Material (TIM):** The "C2" suffix typically refers to the pre-applied thermal interface material (T766), which fills microscopic air gaps between the chip and the heat sink base. --- ### 4. Thermal Performance Data Performance varies based on Airflow (Measured in Linear Feet per Minute - LFM): | Velocity (LFM) | Velocity (m/s) | Thermal Resistance (Ducted) | Thermal Resistance (Unducted) | | :--- | :--- | :--- | :--- | | 100 | 0.5 | 4.30 °C/W | 9.30 °C/W | | 200 | 1.0 | 3.30 °C/W | 5.30 °C/W | | 400 | 2.0 | 2.60 °C/W | 3.50 °C/W |