The **ATS-18D-36-C2-R0** is a specific electronic cooling component, categorized as a high-performance **Heat Sink**. It is manufactured by *Advanced Thermal Solutions (ATS)* as part of their "maxiFLOW" product line, designed to dissipate heat from surface-mount components like CPUs, FPGAs, and GPUs. --- ## Technical Specifications The following table outlines the physical and thermal properties of this specific part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Product Line** | maxiFLOW™ | | **Base Dimensions** | 36.83mm x 36.83mm | | **Height** | 17.78mm | | **Material** | Aluminum (Anodized Blue) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 3.72°C/W (at 200 LFM) | | **Airflow Path** | Horizontal (Spread Fin Design) | --- ## Key Components & Features ### 1. The Fin Design (maxiFLOW™) Unlike standard straight-fin heat sinks, the ATS-18D-36-C2-R0 uses a **tapered fin design**. This increases the surface area for heat dissipation while reducing pressure drop, allowing air to flow more efficiently through the fins. ### 2. pushPIN™ Attachment The "R0" suffix indicates the inclusion of a specialized mounting system: * **Compression Springs:** Provide precise pressure to ensure maximum contact between the heat sink and the chip. * **Plastic/Brass Pins:** Inserted through pre-drilled holes in the Printed Circuit Board (PCB). * **Ease of Assembly:** Allows for secure mechanical attachment without the need for adhesives. ### 3. Thermal Interface Material (TIM) This model typically comes with a pre-applied **Phase Change Material** or thermal pad on the base. This fills the microscopic air gaps between the component and the heat sink, ensuring efficient heat transfer. --- ## Part Number Breakdown Understanding the nomenclature helps in identifying variations: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **18D** | Series / Design Type | | **36** | Dimension size (approx. 36mm) | | **C2** | Thermal Performance/Height code | | **R0** | RoHS Compliant / Revision code | --- ## Application Use Cases * **Telecommunications:** Cooling for high-speed routers and switches. * **Industrial:** Thermal management for embedded controllers. * **Computing:** Secondary cooling for chipsets or power modules on motherboards.